Semiconductor device

ABSTRACT

An object is to reduce off-current of a thin film transistor. Another object is to improve electric characteristics of a thin film transistor. Further, it is still another object to improve image quality of a display device using the thin film transistor. An aspect of the present invention is a thin film transistor including a semiconductor film formed over a gate electrode and in an inner region of the gate electrode which does not reach an end portion of the gate electrode, with a gate insulating film interposed therebetween, a film covering at least a side surface of the semiconductor film, and a pair of wirings over the film covering the side surface of the semiconductor film; in which an impurity element serving as a donor is added to the semiconductor film.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to thin film transistors and displaydevices using the thin film transistors at least for a pixel portion.

2. Description of the Related Art

In recent years, techniques for forming thin film transistors using asemiconductor thin film (with a thickness of about several tens toseveral hundreds of nanometers) which is formed over a substrate havingan insulating surface have attracted attention. Thin film transistorsare widely used in electronic devices such as ICs and electro-opticaldevices, and their development especially as switching elements fordisplay devices has been accelerated.

As a switching element of an image display device, a thin filmtransistor using an amorphous semiconductor film for a channel formationregion, a thin film transistor using a polycrystalline semiconductorfilm with a crystal grain diameter of 100 nm or more for a channelformation region, or the like is used. As a method for forming apolycrystalline semiconductor film, a technique is known in which apulsed excimer laser beam is shaped into a linear laser beam with anoptical system and an amorphous silicon film is crystallized by beingscanned and irradiated with the linear laser beam

As a switching element of an image display device, a thin filmtransistor using a microcrystalline semiconductor film with a crystalgrain diameter of less than 100 nm for a channel formation region isalso used (see Reference 1: Japanese Published Patent Application No.H4-242724 and Reference 2: Japanese Published Patent Application No.2005-49832).

SUMMARY OF THE INVENTION

A thin film transistor using a polycrystalline semiconductor film for achannel formation region has advantages in that its field effectmobility is two or more orders of magnitude greater than that of a thinfilm transistor using an amorphous semiconductor film for a channelformation region and a pixel portion of a semiconductor display deviceand peripheral driver circuits thereof can be formed over the samesubstrate. However, the thin film transistor using a polycrystallinesemiconductor film requires a more complicated process than the thinfilm transistor including an amorphous semiconductor film because ofcrystallization of the semiconductor film. Thus, there are problems suchas reduction in yield and increase in cost.

Further, an inverted staggered thin film transistor using amicrocrystalline semiconductor film has problems in that thecrystallinity of an interface region between a gate insulating film andthe microcrystalline semiconductor film is low and electriccharacteristics of the thin film transistor are poor.

In addition, an inverted staggered thin film transistor using amicrocrystalline semiconductor film for a channel formation region canimprove on-current compared to an inverted staggered thin filmtransistor using an amorphous semiconductor film for a channel formationregion; however, off-current also increases. A display device using thinfilm transistors having high off-current has a problem in that contrastdecreases and power consumption increases.

In view of the above problems, it is an object of the present inventionto reduce off-current of a thin film transistor. In addition, it isanother object of the present invention to improve electriccharacteristics of a thin film transistor. Further, it is still anotherobject of the present invention to improve image quality of a displaydevice using the thin film transistor.

An aspect of the present invention is a thin film transistor including asemiconductor film formed over a gate electrode and in an inner regionof the gate electrode which does not reach an end portion of the gateelectrode, with a gate insulating film interposed therebetween, a filmcovering at least a side surface of the semiconductor film, and a pairof wirings over the film covering the side surface of the semiconductorfilm; in which an impurity element serving as a donor is added to thesemiconductor film. The film covering the side surface of thesemiconductor film is an amorphous semiconductor film or an insulatingfilm. Further, an impurity semiconductor film to which an impurityelement imparting one conductivity type is added, which forms source anddrain regions may be formed in contact with the film covering the sidesurface of the semiconductor film.

Another aspect of the present invention is a thin film transistorincluding a semiconductor film formed over a gate electrode and in aninner region of the gate electrode which does not reach an end portionof the gate electrode, with a gate insulating film interposedtherebetween, an amorphous semiconductor film covering an upper surfaceand a side surface of the semiconductor film, and an impuritysemiconductor film to which an impurity element imparting oneconductivity type is added and which forms source and drain regions overthe amorphous semiconductor film; in which an impurity element servingas a donor is added to the semiconductor film. Note that an end portionof the semiconductor film on the source and drain regions sides mayoverlap with the amorphous semiconductor film and the impuritysemiconductor film. Further, an end portion of the amorphoussemiconductor film is located beyond the source and drain regions.

Further, in the present invention described above, an amorphoussemiconductor film which is different from the above amorphoussemiconductor film may be provided on the upper surface of thesemiconductor film.

Another aspect of the present invention is a thin film transistorincluding a semiconductor film formed over a gate electrode and in aninner region of the gate electrode which does not reach an end portionof the gate electrode, with a gate insulating film interposedtherebetween, an amorphous semiconductor film over the semiconductorfilm, an impurity semiconductor film to which an impurity elementimparting one conductivity type is added and which forms source anddrain regions over the amorphous semiconductor film, an insulating filmcovering a side surface of the semiconductor film, a side surface of theamorphous semiconductor film, and a side surface of the impuritysemiconductor film; and a pair of wirings formed over the insulatingfilm and in contact with the impurity semiconductor film; in which animpurity element serving as a donor is added to the semiconductor film.

Another aspect of the present invention is a thin film transistorincluding a semiconductor film formed over a gate electrode and in aninner region of the gate electrode which does not reach an end portionof the gate electrode, with a gate insulating film interposedtherebetween, an amorphous semiconductor film over the semiconductorfilm, an insulating film covering a side surface of the semiconductorfilm and a side surface of the amorphous semiconductor film, an impuritysemiconductor film to which an impurity element imparting oneconductivity type is added and which forms source and drain regions overthe insulating film, and a pair of wirings being in contact with theimpurity semiconductor film; in which an impurity element serving as adonor is added to the semiconductor film.

Note that end portions of the semiconductor film on the source and drainregions sides overlap with the insulating film.

Further, the semiconductor film is any one of an amorphous silicon film,an amorphous silicon germanium film, an amorphous germanium film, amicrocrystalline silicon film, a microcrystalline germanium film, amicrocrystalline silicon germanium film, a polycrystalline silicon film,a polycrystalline silicon germanium film, or a polycrystalline germaniumfilm. Alternatively, the semiconductor film includes crystal grains towhich an impurity element serving as a donor is added and germaniumwhich is added to cover the crystal grains.

Further, the impurity element serving as a donor is phosphorus, arsenic,or antimony.

Note that, the concentration of the impurity element serving as a donorwhich is added to the semiconductor film is, here, 1×10¹⁵ atoms/cm³ ormore and 3×10¹⁸ atoms/cm³ or less, preferably 6×10¹⁵ atoms/cm³ or moreand 3×10¹⁸ atoms/cm³ or less, more preferably 1×10¹⁶ atoms/cm³ or moreand 3×10¹⁸ atoms/cm³ or less, further more preferably 3×10¹⁶ atoms/cm³or more and 3×10¹⁷ atoms/cm³ or less. The concentration of the impurityelement serving as a donor is defined by the concentration distribution(concentration profile) which is measured by secondary ion massspectrometry.

Note that if the maximum concentration of the impurity element servingas a donor which is added to the semiconductor film is less than 6×10¹⁵atoms/cm³, specifically, less than 1×10¹⁵ atoms/cm³, the quantity of theimpurity element serving as a donor is not enough and thus increase infield effect mobility and in on-current of a thin film transistor cannotbe expected. In addition, if the maximum concentration of the impurityelement serving as a donor which is added to the semiconductor film ishigher than 3×10¹⁸ atoms/cm³, the threshold voltage shifts to the minusside of the gate voltage, and the thin film transistor does not functionwell. Therefore, it is preferable that the concentration of the impurityelement serving as a donor be 1×10¹⁵ atoms/cm³ or more and 3×10¹⁸atoms/cm³ or less, preferably 6×10¹⁵ atoms/cm³ or more and 3×10¹⁸atoms/cm³ or less, more preferably 1×10¹⁶ atoms/cm³ or more and 3×10¹⁸atoms/cm³ or less, further more preferably 3×10¹⁶ atoms/cm³ or more and3×10¹⁷ atoms/cm³ or less.

Further, another aspect of the present invention is a method formanufacturing any of the above-described thin film transistors.

Further, another aspect of the present invention is a display deviceincluding a pixel electrode which is connected to any of theabove-described thin film transistors.

Still further, another aspect of the present invention is a displaydevice in which any of the above-described thin film transistors is usedin a pixel portion, or further in a driver circuit. In the thin filmtransistor of the present invention, a semiconductor film to which donoris added and which has low resistivity is formed in contact with thegate insulating film. Therefore, the thin film transistor has high fieldeffect mobility and on-current compared with a thin film transistorusing an amorphous semiconductor film. Therefore, a part of or theentire driver circuit can be formed over the same substrate as the pixelportion, so that a system-on-panel can be manufactured.

Examples of a display device include a light-emitting device and aliquid crystal display device. A light-emitting device includes alight-emitting element, and a liquid crystal display device includes aliquid crystal element. A light-emitting element includes, in itscategory, an element whose luminance is controlled by current orvoltage, and specifically includes organic electroluminescence (EL) andinorganic electroluminescence (EL).

In addition, the display device includes a panel in which a displayelement is sealed, and a module in which an IC and the like including acontroller are mounted on the panel. An aspect of the present inventionrelates to one mode of an element substrate before a display element iscompleted in a manufacturing process of the display device, and theelement substrate is provided with a means for supplying current orvoltage to the display elements in each of a plurality of pixels.Specifically, the element substrate may be in a state provided with onlya pixel electrode of the display element, a state after a conductivefilm to be a pixel electrode is formed and before the conductive film isetched to form the pixel electrode, or any other state.

Note that a display device in this specification refers to an imagedisplay device, a light-emitting device, or a light source (including alighting device). Further, the display device includes any of thefollowing modules in its category: a module to which a connector such asan flexible printed circuit (FPC), tape automated bonding (TAB) tape, ora tape carrier package (TCP) is attached; a module having a TAB tape ora TCP which is provided with a printed wiring board at the end thereof;and a module having an integrated circuit (IC) which is directly mountedon a display element by a chip on glass (COG) method.

According to the present invention, a semiconductor film with lowresistivity is formed on a surface of an insulating film; an amorphoussemiconductor film or an insulating film which covers side surfaces ofthe semiconductor film is formed; and a pair of wirings are providedover the amorphous semiconductor film or the insulating film; wherebyoff-current of the thin film transistor can be reduced and on-currentand field effect mobility can be improved. Thus, electriccharacteristics of the thin film transistor can be improved. Inaddition, by manufacturing a display device including the thin filmtransistor, improvement in image quality of the display device can beachieved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are cross-sectional views illustrating a thin filmtransistor according to one aspect of the present invention.

FIG. 2 is a cross-sectional view illustrating a thin film transistoraccording to one aspect of the present invention.

FIG. 3 is a cross-sectional view illustrating a thin film transistoraccording to one aspect of the present invention.

FIG. 4 is a cross-sectional view illustrating a thin film transistoraccording to one aspect of the present invention.

FIG. 5 is a cross-sectional view illustrating a thin film transistoraccording to one aspect of the present invention.

FIG. 6 is a cross-sectional view illustrating a thin film transistoraccording to one aspect of the present invention.

FIG. 7 is a cross-sectional view illustrating a thin film transistoraccording to one aspect of the present invention.

FIGS. 8A to 8C are energy band diagrams of a thin film transistoraccording to one aspect of the present invention.

FIGS. 9A, 9C, and 9E are cross-sectional views and FIGS. 9B, 9D, and 9Fare equivalent circuit diagrams of a thin film transistor according toone aspect of the present invention.

FIGS. 10A to 10C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 11A to 11C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 12A to 12C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIG. 13 is a top view illustrating a method for manufacturing a displaydevice according to one aspect of the present invention.

FIGS. 14A to 14C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 15A to 15D illustrate multi-tone masks applicable to the presentinvention.

FIGS. 16A to 16C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIG. 17 is a top view illustrating a method for manufacturing displaydevice according to one aspect of the present invention.

FIGS. 18A to 18C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 19A and 19B are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 20A to 20C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 21A to 21C are cross-sectional views illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 22A to 22C are cross-sectional views illustrating a manufacturingprocess for a thin film transistor according to one aspect of thepresent invention.

FIGS. 23A to 23C are cross-sectional views illustrating a manufacturingprocess for a thin film transistor according to one aspect of thepresent invention.

FIGS. 24A to 24C are cross-sectional views illustrating a manufacturingprocess for a thin film transistor according to one aspect of thepresent invention.

FIGS. 25A to 25D illustrate a manufacturing process for a thin filmtransistor according to one aspect of the present invention.

FIG. 26 is a cross-sectional view illustrating a manufacturing processfor a thin film transistor according to one aspect of the presentinvention.

FIGS. 27A to 27D illustrate multi-tone masks applicable to the presentinvention.

FIG. 28 illustrates a structure of a plasma CVD apparatus applicable tothe present invention.

FIG. 29 illustrates a structure of a plasma CVD apparatus applicable tothe present invention.

FIGS. 30A to 30C illustrate a structure and a film forming procedure ofa plasma CVD apparatus applicable to the present invention.

FIGS. 31A and 31B are cross-sectional views illustrating a thin filmtransistor according to one aspect of the present invention.

FIG. 32 is a cross-sectional view illustrating a method formanufacturing a display device according to one aspect of the presentinvention.

FIG. 33 is a top view illustrating a method for manufacturing a displaydevice according to one aspect of the present invention.

FIG. 34 is a top view illustrating a method for manufacturing a displaydevice according to one aspect of the present invention.

FIG. 35A is a top view and FIG. 35B is a cross-sectional viewillustrating a method for manufacturing a display device according toone aspect of the present invention.

FIGS. 36A to 36C are perspective views illustrating methods formanufacturing a display device according to one aspect of the presentinvention.

FIGS. 37A to 37D are perspective views each illustrating an electronicdevice using a display device according to one aspect of the presentinvention.

FIG. 38 is a block diagram illustrating an electronic device using adisplay device according to one aspect of the present invention.

FIGS. 39A to 39C are perspective views illustrating an electronic deviceusing a display device according to one aspect of the present invention.

FIGS. 40A and 40B are cross-sectional views illustrating thin filmtransistors according to one aspect of the present invention.

FIGS. 41A and 41B are top views illustrating thin film transistorsaccording to one aspect of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiment modes of the present invention will be described withreference to the drawings. Note that the present invention is notlimited to the following description and it will be readily appreciatedby those skilled in the art that modes and details can be modified invarious ways without departing from the spirit and the scope of thepresent invention. Accordingly, the present invention should not beconstrued as being limited to the description of the embodiment modes tobe given below. In a structure of the present invention described below,like portions in different drawings are denoted by the like referencenumerals.

Embodiment Mode 1

Here, a structure of a thin film transistor having a higher field effectmobility and on-current and lower off-current than a conventional thinfilm transistor using a microcrystalline semiconductor film for achannel formation region is described with reference to FIGS. 1A and 1B,FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, FIGS. 8A to 8C, FIGS. 9Ato 9F, and FIGS. 10A to 10C.

In a thin film transistor illustrated in FIG. 1A, a gate electrode 51 isformed over a substrate 50, gate insulating films 52 a and 52 b areformed over the gate electrode, a semiconductor film 58 to which animpurity element serving as a donor is added is formed over the gateinsulating film 52 b, a buffer layer 42 is formed over the semiconductorfilm 58 to which an impurity element serving as a donor is added, a pairof source and drain regions 72 to which an impurity element serving as adonor is added is formed over the buffer layer 42, and wirings 71 a to71 c are formed over the pair of source and drain regions 72.

In the semiconductor film 58 to which an impurity element serving as adonor is added, the impurity element serving as a donor is added at aconcentration of 1×10¹⁵ atoms/cm³ or more and 3×10¹⁸ atoms/cm³ or less,preferably 6×10¹⁵ atoms/cm³ or more and 3×10¹⁸ atoms/cm³ or less, morepreferably 1×10¹⁶ atoms/cm³ or more and 3×10¹⁸ atoms/cm³ or less,further more preferably 3×10¹⁶ atoms/cm³ or more and 3×10¹⁷ atoms/cm³ orless.

As a semiconductor film to which an impurity element serving as a donoris added, an amorphous silicon film, an amorphous silicon germaniumfilm, an amorphous germanium film, a microcrystalline silicon film, amicrocrystalline silicon germanium film, a microcrystalline germaniumfilm, a polycrystalline silicon film, a polycrystalline silicongermanium film, a polycrystalline germanium film, or the like is given.Further, as an alternative to an impurity element serving as a donor,boron, which is an impurity element serving as an acceptor, may be used.

The concentration of an impurity element serving as a donor and is addedto the semiconductor film 58 is set to be in the above range, wherebyresistance at the interface between the gate insulating film 52 b andthe semiconductor film 58 to which an impurity element serving as adonor is added can be reduced. Thus, a thin film transistor having ahigh field effect mobility and high on-current can be manufactured. Notethat if the maximum concentration of the impurity element serving as adonor which is added to the semiconductor film 58 is less than 6×10¹⁵atoms/cm³, specifically less than 1×10¹⁵ atoms/cm³, the quantity of theimpurity element serving as a donor is not enough and thus increase infield effect mobility and in on-current of a thin film transistor cannotbe expected. In addition, if the maximum concentration of the impurityelement serving as a donor which is added to the semiconductor film ishigher than 3×10¹⁸ atoms/cm³, the threshold voltage shifts to the minusside of the gate voltage, and the thin film transistor does not functionwell. Therefore, it is preferable that the concentration of the impurityelement serving as a donor be 1×10¹⁵ atoms/cm³ or more and 3×10¹⁸atoms/cm³ or less, preferably 6×10¹⁵ atoms/cm³ or more and 3×10¹⁸atoms/cm³ or less, more preferably 1×10¹⁶ atoms/cm³ or more and 3×10¹⁸atoms/cm³ or less, further more preferably 3×10¹⁶ atoms/cm³ or more and3×10¹⁷ atoms/cm³ or less.

Here, a microcrystalline semiconductor film is a film which contains asemiconductor having an intermediate structure between amorphous andcrystalline structures (including a single crystal and a polycrystal).This semiconductor is a semiconductor which has a third state that isstable in terms of free energy, and is a crystalline semiconductor whichhas short-range order and lattice distortion, and column-like orneedle-like crystals with a grain size of 0.5 nm to 20 nm grown in thedirection of a normal line with respect to the surface of the substrate.Further, an amorphous semiconductor is present between a plurality ofmicrocrystalline semiconductors. Microcrystalline silicon, which is atypical example of a microcrystalline semiconductor, has a Ramanspectrum which is shifted to a lower wave number side than 520 cm⁻¹ ofsingle crystal silicon. That is to say, the peak of a Raman spectrum ofmicrocrystalline silicon lies between 520 cm⁻¹, which represents singlecrystal silicon, and 480 cm⁻¹, which represents amorphous silicon.Furthermore, the microcrystalline semiconductor film contains hydrogenor a halogen at least 1 at. % in order to terminate dangling bonds. Themicrocrystalline semiconductor film may further contain a rare gaselement such as helium, argon, krypton, or neon to further promotelattice distortion, so that the stability is enhanced and a favorablemicrocrystalline semiconductor film can be obtained. Such descriptionabout a microcrystalline semiconductor film is disclosed in, forexample, U.S. Pat. No. 4,409,134.

The semiconductor film to which an impurity element serving as a donoris added is formed with a thickness of 5 nm or more and 50 nm or less,preferably 5 nm or more and 20 nm or less.

Further, it is preferable that the oxygen concentration or the nitrogenconcentration in the semiconductor film 58 to which an impurity elementserving as a donor is added be less than ten times the concentration ofthe impurity element serving as a donor, typically less than 3×10¹⁹atoms/cm³, preferably less than 3×10¹⁸ atoms/cm³, and the concentrationof carbon is preferably less than or equal to 3×10¹⁸ atoms/cm³. In thecase where the semiconductor film 58 is a microcrystalline semiconductorfilm, by lowering the concentrations of oxygen, nitrogen, or carbonmixed in the semiconductor film 58, generation of defects in themicrocrystalline semiconductor film can be suppressed. Furthermore,oxygen or nitrogen in the microcrystalline semiconductor film is likelyto hinder crystallization. Therefore, in the case where thesemiconductor film 58 is a microcrystalline semiconductor film, bymaking the oxygen concentration or the nitrogen concentration in themicrocrystalline semiconductor film relatively low and by adding animpurity element serving as a donor, crystallinity of themicrocrystalline semiconductor film can be improved.

In addition, since an impurity element serving as a donor is added tothe semiconductor film 58 to which an impurity element serving as adonor of this embodiment mode is added, by adding an impurity elementserving as an acceptor to the semiconductor film 58 to which an impurityelement serving as a donor is added at the same time as or after filmformation, the threshold voltage can be controlled. A typical example ofan impurity element serving as an acceptor is boron, and an impurity gassuch as B₂H₆ or BF₃ may be mixed into silicon hydride at 1 ppm to 1000ppm, preferably 1 ppm to 100 ppm. Further, the concentration of boron ispreferably set to be about one tenth the concentration of an impurityelement serving as a donor, for example, 1×10¹⁴ atoms/cm³ to 6×10¹⁶atoms/cm³.

The buffer layer 42 preferably covers side surfaces and an upper surfaceof the semiconductor film 58 to which an impurity element serving as adonor is added. Further, the gate insulating film 52 b and the bufferlayer 42 are preferably in contact with each other in a surroundingportion of the semiconductor film 58 to which an impurity elementserving as a donor is added.

Further, as illustrated in FIG. 1B, as an alternative to the bufferlayer 42 of FIG. 1A, a first buffer layer 62 which covers the uppersurface of the semiconductor film 58 to which an impurity elementserving as a donor is added and a second buffer layer 42 a which coversan upper surface and side surfaces of the first buffer layer 62 and theside surfaces of the semiconductor film 58 to which an impurity elementserving as a donor is added may be formed.

As for the buffer layer 42, the first buffer layer 62, and the secondbuffer layer 42 a, an amorphous semiconductor film or an amorphoussemiconductor film to which a halogen such as fluorine or chlorine isadded is used. The thickness of the buffer layer 42 and the secondbuffer layer 42 a is 50 nm to 200 nm. As an amorphous semiconductorfilm, an amorphous silicon film, an amorphous silicon film containinggermanium, or the like can be given.

Since the buffer layer 42 and the second buffer layer 42 a are providedbetween the semiconductor film 58 to which an impurity element servingas a donor is added and the wirings 71 a to 71 c, the semiconductor film58 to which an impurity element serving as a donor is added and thewirings 71 a to 71 c are not in contact with each other. Further, thebuffer layer 42 and the second buffer layer 42 a are formed of anamorphous semiconductor film; therefore, the buffer layer 42 and thesecond buffer layer 42 a have a larger energy gap and higher resistivitythan the semiconductor film 58 to which an impurity element serving as adonor is added. In addition, the carrier mobility of the buffer layer 42and the second buffer layer 42 a is as low as one-fifth to one-tenth ofthat of the semiconductor film 58 to which an impurity element servingas a donor is added. Accordingly, in a thin film transistor which iscompleted later, the buffer layer 42 and the second buffer layer 42 aserve as high resistance regions. Thus, the buffer layer 42 and thesecond buffer layer 42 a can reduces leakage current between the sourceand drain regions 72 and the semiconductor film 58 to which an impurityelement serving as a donor is added, and reduce off-current.

In the case where the semiconductor film 58 to which an impurity elementserving as a donor is added is a microcrystalline semiconductor film, byforming an amorphous semiconductor film, or an amorphous semiconductorfilm containing hydrogen, nitrogen, or a halogen as the buffer layer 42or the second buffer layer 42 a on the surface of the semiconductor film58 to which an impurity element serving as a donor is added, surfaces ofcrystal grains contained in the semiconductor film 58 to which animpurity element serving as a donor is added can be prevented from beingoxidized naturally. In particular, in a microcrystalline semiconductorfilm, a crack is likely to be caused due to local stress in a regionwhere an amorphous semiconductor is in contact with microcrystallinegrains. When this crack is exposed to oxygen, the crystal grains areoxidized, whereby silicon oxide is formed. However, by forming thebuffer layer 42 or the first buffer layer 62 on the surface of thesemiconductor film 58 to which an impurity element serving as a donor isadded, the microcrystalline grains can be prevented from being oxidized.Therefore, defects by which carriers are trapped or a region whichhinders carrier movement can be reduced.

As the substrate 50, any of the following substrates can be used:non-alkaline glass substrates made of barium borosilicate glass,aluminoborosilicate glass, aluminosilicate glass, and the like by afusion method or a float method; ceramic substrates; plastic substrateshaving heat resistance enough to withstand a process temperature of thismanufacturing process; and the like. Alternatively, metal substrates ofa stainless steel alloy and the like with the surface provided with aninsulating film may be employed. When the substrate 50 is a motherglass, the substrate may have any of the following sizes: the firstgeneration (320 mm×400 mm), the second generation (400 mm×500 mm), thethird generation (550 mm×650 mm), the fourth generation (680 mm×880 mm,or 730 mm×920 mm), the fifth generation (1000 mm×1200 mm, or 1100mm×1250 mm), the sixth generation (1500 mm×1800 mm), the seventhgeneration (1900 mm×2200 mm), the eighth generation (2160 mm×2460 mm),the ninth generation (2400 mm×2800 mm, or 2450 mm×3050 mm), the tenthgeneration (2950 mm×3400 mm), and the like.

The gate electrode 51 is formed of a metal material. As a metalmaterial, aluminum, chromium, titanium, tantalum, molybdenum, copper, orthe like is used. For example, the gate electrode 51 is preferablyformed using aluminum or a stacked layer structure of aluminum and abarrier metal. As a barrier metal, a metal with a high melting pointsuch as titanium, molybdenum, or chromium is used. A barrier metal ispreferably provided for preventing hillocks and oxidation of aluminum.

The gate electrode 51 is formed with a thickness of 50 nm or more and300 nm or less. The thickness of 50 nm or more and 100 nm or less of thegate electrode 51 can prevent breaking of a semiconductor film, aninsulating film, or a wiring which are formed later due to leveldifferences. Further, the thickness of 150 nm or more and 300 nm or lessof the gate electrode 51 can lower the resistance and increase the sizeof the gate electrode 51.

Since the semiconductor film and the wiring are formed over the gateelectrode 51, the gate electrode 51 is preferably processed to have atapered end portion so that breaking of the semiconductor film and thewiring thereover due to level differences is prevented. Further,although not illustrated, a wiring or a capacitor wiring which isconnected to the gate electrode can also be formed at the same time.

The gate insulating films 52 a and 52 b can each be formed using asilicon oxide film, a silicon nitride film, a silicon oxynitride film,or a silicon nitride oxide film with a thickness of 50 nm to 150 nm.Here, an example in which a silicon nitride film or a silicon nitrideoxide film is formed as the gate insulating film 52 a, and a siliconoxide film or a silicon oxynitride film is formed as the gate insulatingfilm 52 b to form a stacked-layer structure. Note that instead of atwo-layer structure, the gate insulating film can be formed of a singlelayer of a silicon oxide film, a silicon nitride film, a siliconoxynitride film, or a silicon nitride oxide film.

By forming the gate insulating film 52 a using a silicon nitride film ora silicon nitride oxide film, adhesion between the substrate 50 and thegate insulating film 52 a is increased. In addition, in the case where aglass substrate is used as the substrate 50, impurities from thesubstrate 50 can be prevented from diffusing into the semiconductor film58 to which an impurity element serving as a donor is added, the bufferlayer 42, and the second buffer layer 42 a, and oxidation of the gateelectrode 51 can also be prevented. That is to say, film peeling can beprevented, and electric characteristics of the thin film transistorwhich is completed later can be improved. Further, the gate insulatingfilms 52 a and 52 b each having a thickness of 50 nm or more arepreferable because the gate insulating films 52 a and 52 b can alleviatereduction in coverage which is caused by unevenness due to the gateelectrode 51.

Here, a silicon oxynitride film refers to a film that includes moreoxygen than nitrogen, and includes oxygen, nitrogen, silicon, andhydrogen at concentrations ranging from 55 at. % to 65 at. %, 1 at. % to20 at. %, 25 at. % to 35 at. %, and 0.1 at. % to 10 at. %, respectivelyin the case where measurements are performed using Rutherfordbackscattering spectrometry (RBS) and hydrogen forward scattering (HFS).Further, a silicon nitride oxide film refers to a film that includesmore nitrogen than oxygen, and includes oxygen, nitrogen, silicon, andhydrogen at concentrations ranging from 15 at. % to 30 at. %, 20 at. %to 35 at. %, 25 at. % to 35 at. %, and 15 at. % to 25 at. %,respectively in the case where measurements are performed using RBS andHFS. Note that percentages of nitrogen, oxygen, silicon, and hydrogenfall within the ranges given above, where the total number of atomscontained in the silicon oxynitride film or the silicon nitride oxidefilm is defined as 100 at. %.

If an n-channel thin film transistor is formed, phosphorus, which is atypical impurity element, may be added to the pair of source and drainregions 72, which is formed of an impurity semiconductor film to whichan impurity element imparting one conductivity type is added; forexample, an impurity gas such as PH₃ may be added to silicon hydride. Ifa p-channel thin film transistor is formed, boron, which is a typicalimpurity element, may be added; for example, an impurity gas such asB₂H₆ may be added to silicon hydride. By setting the concentration ofphosphorus or boron at 1×10¹⁹ atoms/cm³ to 1×10²¹ atoms/cm³, the pair ofsource and drain regions 72 can form ohmic contact with the wirings 71 ato 71 c and therefore serve as source and drain regions. The pair ofsource and drain regions 72 can be formed of a microcrystallinesemiconductor film or an amorphous semiconductor film. The pair ofsource and drain regions 72 is formed with a thickness of 2 nm or moreand 50 nm or less. By reducing the thickness of the pair of source anddrain regions 72, the throughput can be improved.

The wirings 71 a to 71 c are preferably formed of a single layer or astacked layer using aluminum; copper; or an aluminum alloy to which anelement for preventing hillocks or an element for improving a heatresistance property, such as copper, silicon, titanium, neodymium,scandium, or molybdenum, is added. Alternatively, the wirings 71 a to 71c may have a stacked-layer structure in which a film in contact with theimpurity semiconductor film to which an impurity element imparting oneconductivity type is added is formed of titanium, tantalum, molybdenum,or tungsten, or nitride thereof; and a film of aluminum or an aluminumalloy is formed thereover. Further alternatively, the wirings 71 a to 71c may have a stacked-layer structure in which films of titanium,tantalum, molybdenum, tungsten, or nitride thereof are provided on upperand lower surfaces of an aluminum film or an aluminum alloy film tosandwich the aluminum film or the aluminum alloy film. Here, athree-layer structure of the wirings 71 a to 71 c is illustrated and astacked-layer of conductive films is employed in which the wirings 71 aand 71 c are formed using molybdenum films and the wiring 71 b is formedusing an aluminum film, or the wirings 71 a and 71 c are formed usingtitanium films and the wiring 71 b is formed using an aluminum film.

Although the thin film transistors of FIGS. 1A and 1B have a structurein which side surfaces of the buffer layer 42 or the second buffer layer42 a are in contact with the wirings 71 a to 71 c, a structureillustrated in FIG. 2 in which a buffer layer 87 is not in contact withthe wirings 71 a to 71 c and the wirings 71 a to 71 c are formed overthe buffer layer 87 with a pair of source and drain regions 88interposed therebetween can be employed. Such a thin film transistor canbe formed by employing a photolithography process using a multi-tonemask. Detailed description is given in Embodiment Mode 4.

By employing the structure illustrated in FIG. 2, the semiconductor film58 to which an impurity element serving as a donor is added is not indirect contact with the pair of source and drain regions 88 and thewirings 71 a to 71 c, whereby leakage current and off-current of a thinfilm transistor can be reduced.

A thin film transistor having a structure which is different from thestructures in FIGS. 1A and 1B and FIG. 2 is described with reference toFIG. 3.

In the thin film transistor illustrated in FIG. 3, a gate electrode 51is formed over the substrate 50, the gate insulating films 52 a and 52 bare formed over the gate electrode 51, the semiconductor film 58 towhich an impurity element serving as a donor is added is formed over thegate insulating film 52 b, the buffer layer 42 is formed over thesemiconductor film 58 to which an impurity element serving as a donor isadded, and the pair of source and drain regions 72 to which an impurityelement serving as a donor is added is formed over the buffer layer 42.In addition, an insulating film 67 a covers side surfaces of thesemiconductor film 58 to which an impurity element serving as a donor isadded, the buffer layer 42, and the pair of source and drain regions 72,and pairs of the wirings 71 a to 71 c are formed over the pair of sourceand drain regions 72, and an insulating film 67 a.

The insulating film 67 a can be formed using a film which is similar tothe gate insulating films 52 a and 52 b. The insulating film 67 a mayalternatively be formed of an organic resin. Since the insulating film67 a at least covers the side surfaces of the semiconductor film 58 towhich an impurity element serving as a donor is added, the semiconductorfilm 58 to which an impurity element serving as a donor is added and thewirings 71 a to 71 c are not in contact with each other; therefore,leakage current and off-current can be reduced. In addition, the bufferlayer 42 between the semiconductor film 58 to which an impurity elementserving as a donor is added and the pair of source and drain regions 72formed of an amorphous semiconductor film; therefore, the buffer layer42 has a larger energy gap and higher resistivity than the semiconductorfilm 58 to which an impurity element serving as a donor is added. Inaddition, the carrier mobility of the buffer layer 42 is as low asone-fifth to one-tenth of that of the semiconductor film 58 to which animpurity element serving as a donor is added. Accordingly, in a thinfilm transistor which is completed later, the buffer layer 42 serves asa high resistance region. Thus, the buffer layer 42 can reduce leakagecurrent between the source and drain regions 72 and the semiconductorfilm 58 to which an impurity element serving as a donor is added, andreduce off-current.

Although the thin film transistors of FIG. 3 has a structure in whichthe pair of source and drain regions 72 is formed over the buffer layer42 and the insulating film 67 a covers a part of upper surfaces and sidesurfaces of the pair of source and drain regions 72, structuresillustrated in FIG. 4 and FIGS. 41A and 41B can be employed Theinsulating film 67 a covers side surfaces of the semiconductor film 58to which an impurity element serving as a donor is added and the bufferlayer 42 and one contact hole 68 a is formed around an insulating film67 b over the buffer layer 42 (see FIG. 41A). In that case, theinsulating film 67 a and the insulating film 67 b are separated.Alternatively, a pair of contact holes 68 b and 68 c may be formed (seeFIG. 41B). In that case, the insulating film 67 a and the insulatingfilm 67 b are not separated and connected to each other. In addition, apair of source and drain regions 70 is formed over the insulating film67 a and in contact with the buffer layer 42 in the contact holes 68 band 68 c. Further in addition, the pairs of wirings 71 a to 71 c areformed over the pair of source and drain regions 70.

As illustrated in FIG. 4, by forming a contact hole around theinsulating film 67 b, the insulating film 67 b surrounded by the contacthole serves as a channel protection film; therefore, the buffer layer isnot overetched and damage to the buffer layer due to etching can bereduced during separation of the source and drain regions 70. Further,in the case where a pair of contact holes is formed, the insulating film67 a and the insulating film 67 b are connected to each other, and aregion in the insulating film 67 b serves as a channel protection film;therefore, the buffer layer is not overetched and damage to the bufferlayer due to etching can be reduced during separation of the source anddrain regions 70. A manufacturing process of such thin film transistorsis described in Embodiment Mode 6.

By employing the structure illustrated in FIG. 4, the semiconductor film58 to which an impurity element serving as a donor is added is not indirect contact with the pair of source and drain regions 70 and thewirings 71 a to 71 c, whereby leakage current and off-current of a thinfilm transistor can be reduced.

Note that while a mode in which end portions of the wirings 71 a to 71 cand end portions of the pair of source and drain regions 70 are notaligned is described here, a structure may alternatively be employed inwhich the end portions of the wirings 71 a to 71 c and the end portionsof the pair of source and drain regions 72 are aligned as illustrated inFIG. 5.

Next, a thin film transistor in which a gate insulating film has adifferent structure from the gate insulating film of the above thin filmtransistors is described with reference to FIG. 6.

Instead of the gate insulating films 52 a and 52 b of the thin filmtransistors illustrated in FIGS. 1A and 1B, FIG. 2, FIG. 3, FIG. 4, andFIG. 5, three gate insulating films 52 a, 52 b, and 52 c may be formedas illustrated in FIG. 6. As the gate insulating film 52 c, which is athird layer, a silicon nitride film or a silicon nitride oxide film witha thickness of about 1 nm to 5 nm can be formed.

As a method for forming a silicon nitride film or a silicon nitrideoxide film with a thickness of about 1 nm to 5 nm as the third gateinsulating layer, a plasma CVD method can be employed. Further, it isalso possible to have the gate insulating film 52 b undergo nitridationtreatment with high-density plasma to form a silicon nitride film on thesurface of the gate insulating film 52 b. By nitridation treatment usinghigh-density plasma, a silicon nitride film that contains nitrogen at ahigher concentration can be obtained. High-density plasma is produced byusing a microwave with a high frequency, for example, 1 GHz or 2.45 GHz.With high-density plasma, which has the characteristic of having a lowelectron temperature, a layer can be formed with less plasma damage andfew defects compared to a layer formed by a conventional plasmatreatment because the kinetic energy of active species is low. Inaddition, carrier mobility can be increased because surface roughness ofthe gate insulating film 52 b can be reduced.

Further, instead of the semiconductor film 58 to which an impurityelement serving as a donor is added in the thin film transistorsillustrated in FIGS. 1A and 1B, FIG. 2, FIG. 3, FIG. 4, FIG. 5, and FIG.6, crystal grains 60 to which an impurity element serving as a donor isadded can be dispersed over the gate insulating film 52 b, and asemiconductor film 61 containing germanium as its main component can beformed over the crystal grains 60 to which an impurity element servingas a donor is added and the gate insulating film 52 b as illustrated inFIG. 7.

When the crystal grains 60 to which an impurity element serving as adonor is added are formed using silicon, since the semiconductor film 61containing germanium as its main component has lower resistivity,carriers move through the semiconductor film 61 containing germanium asits main component. Therefore, a thin film transistor which includes asemiconductor film with lower resistivity than the semiconductor film 58to which an impurity element serving as a donor is added is formed.

Next, the operation mechanism of the thin film transistor in which thesemiconductor film to which an impurity element serving as a donor isadded and the buffer layer are stacked over the gate insulating film asillustrated in FIGS. 1A and 1B, FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6,and FIG. 7 is described below. In the following description, amicrocrystalline silicon film to which phosphorus is added is used asthe semiconductor film to which an impurity element serving as a donoris added and an amorphous silicon film is used as the buffer layer.

FIGS. 8A to 8C are energy band diagrams of the thin film transistor ofthe present invention, FIGS. 9A, 9C, and 9E are cross-sectional views ofthe thin film transistor, and FIGS. 9B, 9D, and 9F are equivalentcircuit diagrams.

FIG. 9A illustrates a thin film transistor in which a substrate 20, agate electrode 21, a gate insulating film 22, a microcrystalline siliconfilm 23 to which phosphorus is added, which is the semiconductor film towhich an impurity element serving as a donor is added, an amorphoussilicon film 24, which is a buffer layer, a source region 25S, a drainregion 25D, a source electrode 26S, and a drain electrode 26D arestacked.

FIG. 9B illustrates an equivalent circuit of the thin film transistor inFIG. 9A. Here, resistance R_(Sa) mainly represents a resistance value ofthe source region 25S and the amorphous silicon film 24; resistanceR_(Da) mainly represents a resistance value of the drain region 25D andthe amorphous silicon film 24; resistance R_(ac) mainly represents aresistance value of the amorphous silicon film 24; and resistance R_(μc)mainly represents a resistance value of the microcrystalline siliconfilm 23.

FIG. 8A is a band diagram of the thin film transistor in FIG. 9A in astate in which voltage is not applied to the gate electrode 21 and showsa case where a Fermi level Ef of the amorphous silicon film 24 and aFermi level Efm of the gate electrode are equal to each other.

The a microcrystalline silicon film 23 to which phosphorus is added,which is the semiconductor film to which an impurity element serving asa donor is added, of this embodiment mode is an n-type semiconductorbecause it contains phosphorus which is one of impurity elements servingas a donor; thus, the Fermi energy Ef is close to a conduction bandenergy Ec in the microcrystalline silicon film 23 to which phosphorus isadded. In addition, the microcrystalline silicon film 23 to whichphosphorus is added is an n-type film, and the amorphous silicon film 24is an i-type film. Further, when the band gap (an energy differencebetween the bottom Ec of the conduction band and the top Ev of thevalence band) of the microcrystalline silicon film is 1.4 eV, forexample, and the band gap of the amorphous silicon film is 1.7 eV, forexample, an n-i junction is formed at the interface between themicrocrystalline silicon film 23 to which phosphorus is added and theamorphous silicon film 24. Thus, the energy band near the interfacebetween the microcrystalline silicon film 23 to which phosphorus isadded and the amorphous silicon film 24 curves, and the bottom Ec of theconduction band of the microcrystalline silicon film 23 to whichphosphorus is added is below the bottom Ec of the conduction band of theamorphous silicon film 24.

Then, the gate electrode 21 is supplied with positive voltage, thesource electrode 26S is grounded to have ground potential, and the drainelectrode 26D is supplied with positive voltage. The path through whichdrain current and carriers flow between the drain electrode 26D and thesource electrode 26S at this time is illustrated in FIG. 9C. As denotedby a dotted line in FIG. 9C, drain current flows through the drainelectrode 26D, the drain region 25D, the amorphous silicon film 24, apart close to the interface with the gate insulating film 22 of themicrocrystalline silicon film 23 to which phosphorus is added, theamorphous silicon film 24, the source region 25S, and the sourceelectrode 26S. In other words, a carrier path between the drainelectrode 26D and the source electrode 26S is formed through the sourceelectrode 26S, the source region 25S, the amorphous silicon film 24, apart close to the interface with the gate insulating film 22 of themicrocrystalline silicon film 23, the amorphous silicon film 24, thedrain region 25D, and the drain electrode 26D.

FIG. 9D illustrates an equivalent circuit of the thin film transistorillustrated in FIG. 9C. Here, forward bias is applied at the interfacebetween the source region 25S and the amorphous silicon film 24, so thatthe resistance R_(Sa) represents a resistance value of the source region25S and the amorphous silicon film 24 connected in forward direction,and the resistance R_(Sa) is low. In addition, at the interface betweenthe drain region 25D and the amorphous silicon film 24, reverse bias isapplied and a depletion layer is formed, so that the resistance R_(Da)is high. The resistance R_(μc) represents a resistance value of themicrocrystalline silicon film 23 to which phosphorus is added and whichis inverted. Here, the inverted microcrystalline silicon film 23 towhich phosphorus is added refers to the microcrystalline silicon film 23to which phosphorus is added and in which conduction electrons areinduced to the interface with the gate insulating film 22 by applyingpotential to the gate electrode 21. The resistance R_(Sa) is much lowerthan the resistance R_(Da) and the resistance R_(μc).

FIG. 8B is a band diagram of the thin film transistor illustrated inFIG. 9C in a state in which positive voltage, typically, positivevoltage which is high enough to form an inversion layer, is applied tothe gate electrode 21. By application of positive voltage to the gateelectrode 21, an energy band in the microcrystalline silicon film 23 towhich phosphorus is added curves, and a region where the bottom Ec ofthe conduction band is lower than the Fermi level Ef, i.e., an inversionlayer, is formed, and electrons are induced to a part close to theinterface with the gate insulating film 22 of the microcrystallinesilicon film 23 to which phosphorus is added so as to enhance thedensity of conduction electrons. Positive voltage at which the inversionlayer begins to be formed substantially equals to the threshold voltageVth.

In an actual device structure, the resistance R_(Da) is typically formedin the amorphous silicon film with a thickness of about 0.1 μm to 0.3 μm. On the other hand, the resistance R_(μc) is typically formed in themicrocrystalline silicon film to which phosphorus is added with a lengthof about 3 μm to 6 μm. Therefore, the traveling distance of carriers inthe channel is 10 to 30 times as long as that in the amorphous siliconfilm. By making the resistance R_(μc) of the microcrystalline siliconfilm much smaller than the resistance R_(ac) of the amorphous siliconfilm, on-current and field effect mobility of the thin film transistorcan be increased. Therefore, by adding the impurity element serving as adonor, phosphorus here, to the microcrystalline silicon film, thecarrier concentration can be increased, and thus, electric conductivityof the microcrystalline silicon film can be improved. As a result,on-current can be increased.

On the other hand, the gate electrode 21 is supplied with negativevoltage, the source electrode 26S is grounded to have ground potential,and the drain electrode 26D is supplied with positive voltage. Adrain-current and carrier path at this time is illustrated in FIG. 9E.The path through which drain current flows between the drain electrode26D and the source electrode 26S at this time is illustrated. As denotedby a dotted line in FIG. 9E, drain current flows through the drainelectrode 26D, the drain region 25D, the vicinity of the surface of theamorphous silicon film 24, the source region 25S, and the sourceelectrode 26S. In other words, a carrier path between the drainelectrode 26D and the source electrode 26S is formed through the sourceelectrode 26S, the source region 25S, the vicinity of the surface of theamorphous silicon film 24, the drain region 25D, and the drain electrode26D.

FIG. 9F illustrates an equivalent circuit of the thin film transistorillustrated in FIG. 9E. Here, forward bias is applied at the interfacebetween the source region 25S and the amorphous silicon film 24, so thatthe resistance R_(Sa) represents a resistance value of the source region25S and the amorphous silicon film 24 connected in forward direction,and the resistance R_(Sa) is low. In addition, at the interface betweenthe drain region 25D and the amorphous silicon film 24, reverse bias isapplied and a depletion layer is formed, so that the resistance R_(Da)is high. The resistance R_(ac) represents a resistance value of theamorphous silicon film 24. The resistance R_(Sa) is much lower than theresistance R_(Da) and the resistance R_(ac).

FIG. 8C is a band diagram of the thin film transistor illustrated inFIG. 9E in a state in which negative voltage is applied to the gateelectrode 21. By applying negative voltage to the gate electrode 21,electrons are forced away from the interface between the gate insulatingfilm 22 and the microcrystalline silicon film 23 to which phosphorus isadded. As a result, the electron density is depleted, and a depletionlayer is formed. In this condition, conduction electrons are removedfrom the conduction band, and at the interface between themicrocrystalline silicon film 23 to which phosphorus is added and thegate insulating film 22, the bottom Ec of the conduction band of themicrocrystalline silicon film 23 to which phosphorus is added is higherthan the Fermi level Ef. In addition, the surface of themicrocrystalline silicon film 23 to which phosphorus is added has higherresistance than the amorphous silicon film 24. Accordingly, whennegative voltage is applied to the gate electrode 21, electrons passthrough the amorphous silicon film 24, so that current flows. In thevicinity of the interface between the amorphous silicon film 24 and thedrain region 25D, reverse bias is applied, and a depletion layer isformed, so that the resistance R_(Da) is increased. However, when theamorphous silicon film 24 has defects, impurity elements, orrecombination centers, the defects, the impurity elements, or therecombination centers serve as a leakage path, whereby a depletion layerdoes not spread and off-current flows. Therefore, the amorphous siliconfilm 24 is formed of a film which forms perfect bonding at the interfacewith the drain region 25D and has less impurity elements, less defects,and less recombination centers. That is, by forming the amorphoussilicon film 24 whose photoelectric current is high and whose darkcurrent is low, leakage current of the thin film transistor can bereduced.

Note that the microcrystalline silicon film 23 to which phosphorus isadded is used as the semiconductor film to which an impurity elementserving as a donor is added in the description above. However, otherfilms such as an amorphous silicon film, an amorphous germanium film, anamorphous silicon germanium film, a microcrystalline germanium film, amicrocrystalline silicon germanium film, a polycrystalline silicon film,a polycrystalline germanium film, or a polycrystalline silicon germaniumfilm may be used, in which, similarly, by adding an impurity elementserving as a donor, such as phosphorus, arsenic, or antimonym, a bandgap become smaller than the band gap of amorphous silicon which forms abuffer layer. Accordingly, at the interface between the semiconductorfilm to which an impurity element serving as a donor is added and thebuffer layer, an n-i junction is formed, whereby an energy band curvesand the bottom Ec of the conduction band of the semiconductor film towhich an impurity element serving as a donor is added lies below thebottom Ec of the conduction band of the buffer layer. Therefore, thinfilm transistor characteristics which are similar to characteristics ofabove thin film transistors can be obtained.

As described in this embodiment mode, when positive voltage is appliedto the gate electrode, the semiconductor film with high conductivity towhich an impurity element serving as a donor is added is used as atravel region for carriers; while when negative voltage is applied tothe gate electrode, the amorphous semiconductor film with lowconductivity is used as a travel region for carriers. Thus, a thin filmtransistor with a high ON/OFF ratio can be obtained. That is, a thinfilm transistor which has high on-current and high field effect mobilityand which can suppress off-current can be manufactured.

By providing a film with low resistivity over a gate insulating film, asemiconductor film to which an impurity element serving as a donor isadded here, on-current and field effect mobility of the thin filmtransistor can be improved. Further, by providing an amorphoussemiconductor film or an insulating film to cover side surfaces of thesemiconductor film to which an impurity element serving as a donor isadded, off-current of the thin film transistor can be reduced. That is,a higher-performance thin film transistor can be formed. Accordingly, adriving frequency of a display device can be increased, whereby a panelsize can be increased and high density of pixels can be well achieved.In addition, since the thin film transistor of this embodiment mode isan inverted staggered thin film transistor, thin film transistors can bemanufactured with fewer steps over a large substrate.

Embodiment Mode 2

In this embodiment mode, another structure of the thin film transistorof Embodiment Mode 1 is described with reference to FIG. 1A and FIGS.40A and 40B. Although FIG. 1A is referred to here, this embodiment modecan be applied as appropriate to the thin film transistors of otherdrawings described in Embodiment Mode 1.

In FIG. 1A, the end portions of the pair of source and drain regions 72serving as source and drain regions and the semiconductor film 58 towhich an impurity element serving as a donor is added overlap.

In addition, in the thin film transistor illustrated in FIG. 40A, theend portions of the pair of source and drain regions 72 serving assource and drain regions and the end portions of the semiconductor film58 to which an impurity element serving as a donor is added overlap. Ina thin film transistor in which the end portions of the pair of sourceand drain regions 72 serving as source and drain regions and the endportions of the semiconductor film 58 to which an impurity elementserving as a donor is added overlap as indicated by a dotted line inFIG. 40A or are substantially aligned as in FIG. 1A, a travelingdistance of carriers is short and thus on-current can be improved.

Alternatively, a so-called off-set structure illustrated in FIG. 40B inwhich the end portions of the pair of source and drain regions 72serving as source and drain regions and the end portion of thesemiconductor film 58 to which an impurity element serving as a donor isadded do not overlap can be employed. By having such a structure, thepair of source and drain regions 72 serving as source and drain regionsand the semiconductor film 58 to which an impurity element serving as adonor is added are spaced; accordingly, an electric field formed in thebuffer layer 42 is relieved and off-current can be reduced.

Embodiment Mode 3

In this embodiment mode, a manufacturing process for a thin filmtransistor having high field effect mobility and on-current, and lowoff-current is described. Here, as a typical example, method formanufacturing the thin film transistor of FIG. 1B in Embodiment Mode 1is described.

An n-type thin film transistor having an amorphous semiconductor film ora microcrystalline semiconductor film has higher field effect mobilitythan a p-type thin film transistor having an amorphous semiconductorfilm or a microcrystalline semiconductor film, and therefore is moresuitable for being used in a driver circuit. It is desired that all thinfilm transistors formed over one substrate have the same polarity inorder to reduce the number of manufacturing steps. Here, description ismade using an n-channel thin film transistor.

As illustrated in FIG. 10A, the gate electrode 51 is formed over thesubstrate 50, and the gate insulating films 52 a and 52 b are formedover the gate electrode 51.

The gate electrode 51 is formed by a sputtering method, a CVD method, aplating method, a printing method, a droplet discharge method, or thelike using any of the metal materials which are given as materials forthe gate electrode 51 in Embodiment Mode 1. Here, a molybdenum film isformed as a conductive film over the substrate 50 by a sputtering methodand is etched using a resist mask which is formed using a firstphotomask. Thus, the gate electrode 51 is formed.

The gate insulating films 52 a and 52 b can each be a silicon oxidefilm, a silicon nitride film, a silicon oxynitride film, or a siliconnitride oxide film which is formed by a CVD method, a sputtering method,or the like. Here, a mode is described in which a silicon nitride filmor a silicon nitride oxide film is formed as the gate insulating film 52a, and a silicon oxide film or a silicon oxynitride film is formed asthe gate insulating film 52 b to form a stacked-layer structure.

Then, a semiconductor film 45 to which an impurity element serving as adonor is added is formed over the gate insulating film 52 b. Thesemiconductor film 45 to which an impurity element serving as a donor isadded is formed by a plasma CVD method or a sputtering method. Further,the semiconductor film 45 to which an impurity element serving as adonor is added is formed through heat treatment of a semiconductor filmwhich is formed by a plasma CVD method or a sputtering method. As theheat treatment, heat may be added or laser beam irradiation or lamplight irradiation may be performed.

In the case of forming the semiconductor film 45 to which an impurityelement serving as a donor is added by a plasma CVD method, in areaction chamber of a plasma CVD apparatus, a deposition gas containingsilicon or germanium, hydrogen, and a gas which contains an impurityelement serving as a donor are mixed; and an amorphous semiconductorfilm or a microcrystalline semiconductor film is formed using glowdischarge plasma. Note that in the case of forming an amorphoussemiconductor film, a deposition gas containing silicon or germanium anda gas which contains an impurity element serving as a donor are mixed,and an amorphous semiconductor film can be formed using glow dischargeplasma without using hydrogen.

In the step of forming the semiconductor film 45 to which an impurityelement serving as a donor is added, glow discharge plasma is generatedby applying high-frequency power with a frequency of 1 MHz, to 30 MHz,typically 13.56 or 27.12 MHz, or high-frequency power with a frequencyin the VHF band of more than 30 MHz to about 300 MHz, typically 60 MHz.

As typical examples of the deposition gas containing silicon orgermanium, SiH₄, Si₂H₆, GeH₄, and Ge₂H₆ are given. As the impurityelement serving as a donor, phosphorus, arsenic, antimony, or the likecan be used.

Alternatively, as the semiconductor film 45 to which an impurity elementserving as a donor is added, an amorphous silicon film, an amorphoussilicon germanium film, an amorphous germanium film, or the like can beformed by sputtering using a silicon target, a germanium target, asilicon germanium target, or the like with helium, argon, neon, or thelike. In the sputtering, a semiconductor film to which an impurityelement serving as a donor is added can be formed by introducing a gascontaining an impurity element serving as a donor into a film formationchamber.

Further, by heat treatment of an amorphous semiconductor film ormicrocrystalline semiconductor film to which an impurity element servingas a donor is added, a crystal semiconductor film to which an impurityelement serving as a donor is added can be formed.

Note that instead of forming the semiconductor film 45 to which animpurity element serving as a donor is added, it is possible to form asemiconductor film which does not contain an impurity element serving asa donor and to form an insulating film to which an impurity elementserving as a donor is added as the gate insulating film 52 b. Forexample, the gate insulating film 52 b can be formed using a siliconoxide film, a silicon nitride film, a silicon oxynitride film, or asilicon nitride oxide film to which an impurity element serving as adonor (phosphorus, arsenic, or antimony) is added. Further, in the casewhere the gate insulating film 52 b has a stacked-layer structure, animpurity element serving as a donor may be added to a layer which is incontact with the semiconductor film 45 or in contact with the gateinsulating film 52 a.

As a method for forming an insulating film to which an impurity elementserving as a donor is added as the gate insulating film 52 b, aninsulating film may be formed using a source gas of the insulating filmwith a gas containing an impurity element serving as a donor. Forexample, by a plasma CVD method using a silane, ammonia, and phosphine,a silicon nitride film to which phosphorus is add can be formed.Alternatively, a silicon oxynitride film to which phosphorus is addedcan be formed by a plasma CVD method using a silane, dinitrogenmonoxide, ammonia, and phosphine.

Further, a gas containing an impurity element serving as a donor may befed into a reaction chamber of a film formation apparatus before formingthe gate insulating film 52 b so that the impurity element serving as adonor is adsorbed onto the surface of the substrate 50 and an inner wallof the reaction chamber. After that, the gate insulating film 52 b isformed. Then, a semiconductor film is deposited while taking in theimpurity element serving as a donor. Thus, the semiconductor film 45 towhich an impurity element serving as a donor is added can be formed.

Still further, before forming the semiconductor film 45 to which animpurity element serving as a donor is added, a gas containing animpurity element serving as a donor may be fed into a reaction chamberof a film formation apparatus so that the impurity element serving as adonor is adsorbed onto the gate insulating film 52 b and an inner wallof the reaction chamber. After that, a semiconductor film is depositedwhile taking in the impurity element serving as a donor. Thus thesemiconductor film 45 to which an impurity element serving as a donor isadded can be formed.

Note that in the case of forming a microcrystalline semiconductor filmas a semiconductor film 45 to which an impurity element serving as adonor is added, a fluoride gas containing silicon or germanium may beused with a deposition gas containing silicon or germanium in order toform the semiconductor film 45 to which an impurity element serving as adonor is added. In that case, it is preferable that the flow ratio of asilane is 0.1 to 50 times, preferably 1 to 10 times that offluorosilane. By using a fluoride gas containing silicon or germaniumwith a deposition gas containing silicon or germanium in order to formthe semiconductor film 45 to which an impurity element serving as adonor is added, an amorphous semiconductor component in a place wherecrystal growth proceeds in a microcrystalline semiconductor film isetched by fluorine radicals; therefore, crystals with high crystallinitygrow. That is, a microcrystalline semiconductor film having highcrystallinity can be formed.

Further, an energy band width may be adjusted to be 0.9 eV to 1.1 eV bymixing germanium hydride or germanium fluoride such as GeH₄ or GeF₄ intoa gas such as a silane. By adding germanium to silicon, the temperaturecharacteristic of a thin film transistor can be changed.

In the film formation treatment of the semiconductor film 45 to which animpurity element serving as a donor is added, helium may be added to areaction gas, in addition to a silane and hydrogen. Helium has anionization energy of 24.5 eV, which is the largest among all gases, andhas a metastable state in the level of about 20 eV, which is a littlelower than the ionization energy; therefore, only about 4 eV, thedifference therebetween, is necessary for ionization during discharging.Therefore, the discharge starting voltage also has the lowest valueamong all gases. By such characteristics, plasma can be held stably withhelium. Further, since uniform plasma can be formed, even if the area ofa substrate over which the semiconductor film to which an impurityelement serving as a donor is added is deposited is large, plasma havinguniform density can be obtained.

Here, as a mode of the semiconductor film 45 to which an impurityelement serving as a donor is added, a microcrystalline silicon film towhich phosphorus is added is formed by a plasma CVD method.

In a reaction chamber of a plasma CVD apparatus, a deposition gascontaining silicon or germanium, which is a silane here, hydrogen,and/or a rare gas are mixed, and a microcrystalline silicon film isformed using glow discharge plasma. Hydrogen is diluted to so that theflow rate of hydrogen is 10 to 2000 times, preferably 50 to 200 timesthat of the silane, and the microcrystalline silicon film is formed. Thesubstrate heating temperature is 100° C. to 300° C., preferably 120° C.to 220° C. Further, by using phosphine with the above-mentioned sourcegas, a microcrystalline silicon film to which an impurity elementserving as a donor is added can be formed. Here, 0.01% to 5% phosphine(diluted with a silane or hydrogen) gas, a silane, and hydrogen are usedto form a microcrystalline silicon film to which phosphorus is added.

Then, a first buffer layer 54 is formed. As the first buffer layer 54,an amorphous semiconductor film can be formed by a plasma CVD methodusing a deposition gas containing silicon or germanium. Alternatively,by diluting a deposition gas containing silicon or germanium with one orplural kinds of rare gases selected from helium, argon, krypton, andneon, an amorphous semiconductor film can be formed. Furtheralternatively, by using hydrogen at a flow rate which is 1 or more and10 or less times, preferably 1 or more and 5 or less times a flow rateof a silane gas, a hydrogen-containing amorphous semiconductor film canbe formed. Further, a halogen such as fluorine or chlorine may be addedto the above hydrogenated semiconductor film or hydrogen-containingamorphous semiconductor film.

Further, as the first buffer layer 54, an amorphous semiconductor filmcan be formed by sputtering using a semiconductor target such as asilicon target, a silicon germanium target, or a germanium target withhydrogen or a rare gas.

As the amorphous semiconductor film, an amorphous silicon film, anamorphous silicon germanium film, or the like can be employed.

The thickness of the first buffer layer 54 is 10 nm to 100 nm,preferably 30 nm to 50 nm.

In the case where the semiconductor film 45 to which an impurity elementserving as a donor is added is a microcrystalline semiconductor film, byforming an amorphous semiconductor film, or an amorphous semiconductorfilm containing hydrogen, nitrogen, or a halogen as the first bufferlayer 54 on the surface of the semiconductor film 45 to which animpurity element serving as a donor is added, surfaces of crystal grainscontained in the microcrystalline semiconductor film can be preventedfrom being oxidized naturally. In particular, in a region where anamorphous semiconductor is in contact with microcrystalline grains, acrack is likely to be caused due to local stress. When this crack isexposed to oxygen, the crystal grains are oxidized, whereby siliconoxide is formed. However, by forming the first buffer layer 54 on thesurface of the semiconductor film 45 to which an impurity elementserving as a donor is added, the microcrystalline grains can beprevented from being oxidized.

In addition, it is preferable that the first buffer layer 54 be formedby a plasma CVD method at a temperature of 300° C. to 400° C. afterforming the semiconductor film 45 to which an impurity element servingas a donor is added. By the film formation, hydrogen is supplied to thesemiconductor film 45, and the same effect as hydrogenating thesemiconductor film 45 can be obtained. In other words, by depositing thefirst buffer layer 54 over the semiconductor film 45 to which animpurity element serving as a donor is added, hydrogen is diffused intothe semiconductor film 45 to which an impurity element serving as adonor is added, whereby dangling bonds can be terminated.

Then, a resist is applied over the first buffer layer 54, then, theresist is exposed to light and developed through a photolithographyprocess using a second photomask to form a resist mask. Then, using theresist mask, the first buffer layer 54 and the semiconductor film 45 towhich an impurity element serving as a donor is added are etched to formthe first buffer layer 62 and the semiconductor film 58 to which animpurity element serving as a donor is added as illustrated in FIG. 10B.

Then, as illustrated in FIG. 10C, a second buffer layer 41 and animpurity semiconductor film 55 to which an impurity element impartingone conductivity type is added are formed over the first buffer layer 62and the gate insulating film 52 b.

The second buffer layer 41 is formed in a manner similar to that of thefirst buffer layer 54. In some cases, the second buffer layer 41 ispartly etched in a later step of formation of source and drain regions,and therefore is preferably formed with a thickness such that the secondbuffer layer 41 is partly left after the etching. Typically, it ispreferable to form the second buffer layer 41 with a thickness of 30 nmor more and 500 nm or less, preferably 50 nm or more and 200 nm or less.

In a display device in which high voltage (e.g., about 15 V) is appliedto thin film transistors, typically, in a liquid crystal display device,if the first buffer layer 54 and the second buffer layer 41 are formedthick, withstand drain voltage is increased. Therefore, deterioration ofthe thin film transistors can be reduced even if high voltage is appliedto the thin film transistors.

Since the first buffer layer 54 and the second buffer layer 41 areformed using an amorphous semiconductor film or an amorphoussemiconductor film containing hydrogen or a halogen, the first bufferlayer 54 and the second buffer layer 41 have a larger energy gap thanthe semiconductor film 58 to which an impurity element is added, andhigher resistivity and lower mobility. Therefore, in a thin filmtransistor which is completed later, the first buffer layer and thesecond buffer layer, which are formed between the source and drainregions and the semiconductor film 58 to which an impurity elementserving as a donor is added, serve as high resistance regions; thereforeoff-current of the thin film transistor can be reduced. When the thinfilm transistor is used as a switching element of a display device, thecontrast of the display device can be improved.

If an n-channel thin film transistor is formed, phosphorus, which is atypical impurity element, may be added to the impurity semiconductorfilm 55 to which an impurity element imparting one conductivity type isadded; for example, an impurity gas such as PH₃ may be added to adeposition gas containing silicon or germanium. If a p-channel thin filmtransistor is formed, boron, which is a typical impurity element, may beadded; for example, a gas containing an impurity element such as B₂H₆may be added to a deposition gas containing silicon or germanium. Bysetting the concentration of phosphorus or boron at 1×10¹⁹ atoms/cm³ to1×10²¹ atoms/cm³, the impurity semiconductor film 55 can form ohmiccontact with the wirings 71 a to 71 c, which are formed later, andtherefore serve as source and drain regions. The impurity semiconductorfilm 55 to which an impurity element imparting one conductivity type isadded can be formed of a microcrystalline semiconductor film or anamorphous semiconductor film. The impurity semiconductor film 55 towhich an impurity element imparting one conductivity type is added isformed with a thickness of 2 nm or more and 50 nm or less. By reducingthe thickness of the impurity semiconductor film to which an impurityelement imparting one conductivity type is added, the throughput can beimproved.

Then, a resist mask is formed over the impurity semiconductor film 55 towhich an impurity element imparting one conductivity type is added. Theresist mask is formed by a photolithography technique. Here, a resistwhich is applied over the impurity semiconductor film 55 to which animpurity element imparting one conductivity type is added is exposed tolight and developed using a third photomask to form the resist mask.

Then, using the resist mask, the second buffer layer 41 and the impuritysemiconductor film 55 to which an impurity element imparting oneconductivity type is added are etched and separated to form the secondbuffer layer 42 and an impurity semiconductor film 63 to which animpurity element imparting one conductivity type is added as illustratedin FIG. 11A. Then, the resist mask is removed.

The second buffer layer 42 covers the semiconductor film 58 to which animpurity element serving as a donor is added, whereby leakage currentbetween source and drain regions-formed over the second buffer layer 42and the semiconductor film 58 to which an impurity element serving as adonor is added can be prevented. In addition, leakage current between awiring and the semiconductor film 58 to which an impurity elementserving as a donor is added can be prevented.

Then, as illustrated in FIG. 11B, conductive films 65a to 65c are formedover the impurity semiconductor film 63 to which an impurity elementimparting one conductivity type is added and the gate insulating film 52b. The conductive films 65 a to 65 are formed by a sputtering method, aCVD method, a printing method, a droplet discharge method, a vapordeposition method, or the like. Here, the conductive film having athree-layer structure of the conductive films 65 a to 65 c isillustrated, and a stacked-layer structure in which molybdenum films areused as the conductive films 65 a and 65 c and an aluminum film is usedas the conductive film 65 b, or a stacked-layer structure in whichtitanium films are used as the conductive films 65 a and 65 c and analuminum film is used as the conductive films 65 b is employed. Theconductive films 65 a to 65 c are formed by a sputtering method or avacuum evaporation method.

The conductive films 65 a to 65 c can be formed using any of the metalmaterials which are listed as materials for the wirings 71 a to 71 c inEmbodiment Mode 1.

Then, a resist mask is formed over the conductive film 65 c through aphotolithography process using a fourth photomask.

Then, the conductive films 65 a to 65 c are etched using the resist maskto form pairs of the wirings 71 a to 71 c (which serve as source anddrain electrode) as illustrated in FIG. 11C.

Then, the impurity semiconductor film 63 to which an impurity elementimparting one conductivity type is added is etched and separated usingthe resist mask. As a result, the pair of source and drain regions 72can be formed as illustrated in FIG 11C. Note that in this etchingprocess, the second buffer layer 42 is also partly etched. The secondbuffer layer 42 which is partly etched and has a depressed portion isreferred to as a second buffer layer 43. The source and drain regionsand the depressed portion of the buffer layer can be formed in the sameprocess. The depth of the depressed portion of the second buffer layer43 is set to half to one-third of the thicknesses of the thickest regionin the second buffer layer 43, whereby the source region and the drainregion can be spaced apart from each other. Accordingly, leakage currentbetween the source region and drain region can be reduced. Then, theresist mask is removed.

Next, dry etching may be performed under such a condition that thesecond buffer layer 43 which is exposed is not damaged and an etchingrate of the second buffer layer 43 is low. Through this step, an etchingresidue on the second buffer layer 43 between the source and drainregions, a residue of the resist mask, and a contamination source in theapparatus used for removal of the resist mask can be removed, wherebythe source and drain regions can be certainly insulated. As a result,leakage current of the thin film transistor can be reduced; therefore, athin film transistor with small off-current and high withstand voltagecan be manufactured. Note that a chlorine gas may be used for an etchinggas, for example.

Through the above process, a channel-etched thin film transistor 74 canbe formed.

Next, as illustrated in FIG. 12A, a protective insulating film 76 isformed over the wirings 71 a to 71 c, the source and drain regions 72,the second buffer layer 43, and the gate insulating film 52 b. Theprotective insulating film 76 can be formed in a manner to that of thegate insulating films 52 a and 52 b. Note that the protective insulatingfilm 76 is provided to prevent intrusion of contaminating impuritiessuch as organic matters, metal, or water vapor contained in theatmosphere; thus, a dense film is preferably used for the protectiveinsulating film 76. Further, by using a silicon nitride film as theprotective insulating film 76, the oxygen concentration in the secondbuffer layer 43 can be 5×10¹⁹ atoms/cm³ or less, preferably 1×10¹⁹atoms/cm³ or less, so that the second buffer layer 43 can be preventedfrom being oxidized.

Then, an insulating film 101 is formed over the protective insulatingfilm 76. The insulating film 101 is formed using a photosensitiveorganic resin here. Then, the insulating film 101 is exposed to lightand developed using a fifth photomask to form an insulating film 102which exposes the protective insulating film 76. Then, the protectiveinsulating film 76 is etched using the insulating film 102 to form acontact hole 111 which partly exposes the wiring 71 c (see FIG. 12B).

Then, as illustrated in FIG. 12C, a pixel electrode 77 is formed in thecontact hole 111. Here, after a conductive film is formed over theinsulating film 102, the conductive film is etched using a resist maskwhich is formed through a photolithography process using a sixthphotomask, whereby the pixel electrode 77 is formed.

The pixel electrode 77 can be formed of a light-transmitting conductivematerial such as indium oxide containing tungsten oxide, indium zincoxide containing tungsten oxide, indium oxide containing titanium oxide,indium tin oxide containing titanium oxide, ITO, indium zinc oxide, orindium tin oxide to which silicon oxide is added.

Alternatively, the pixel electrode 77 can be formed using a conductivecomposition containing a conductive high-molecular compound (alsoreferred to as a conductive polymer). The pixel electrode 77 which isformed of a conductive composition preferably has a sheet resistance of10000 Ω/square or less and a transmittance for light at a wavelength of550 nm of 70% or more. In addition, the resistivity of the conductivehigh-molecular compound contained in the conductive composition ispreferably 0.1 Ω·cm or less.

As the conductive high-molecular compound, a so-called π-electronconjugated conductive high-molecular compound can be used. For example,polyaniline or a derivative thereof, polypyrrole or a derivativethereof, polythiophene or a derivative thereof, a copolymer of two ormore kinds thereof, and the like can be given.

Here, as the pixel electrode 77, a film of ITO is formed by a sputteringmethod, and then, a resist is applied to the ITO film. Then, the resistis exposed to light and developed using the sixth photomask. Then, theITO film is etched using the resist mask to form the pixel electrode 77.

Note that FIG. 12C is a cross-sectional view taken along line Q-R inFIG. 13. In FIG. 13, it is not illustrated that the end portions ofsource and drain regions 72 are exposed and located beyond the endportion of the wiring 71 c. Furthermore, one of the pair of wiringssurrounds the other wirings (specifically, the former wiring is in aU-shape or a C-shape). Thus, an area in which carriers travel can beincreased, and thus the amount of current can be increased and an areaof the thin film transistor can be reduced. In addition, thesemiconductor film 58 to which an impurity element serving as a donor isadded, the gate insulating films 52 a and 52 b, and the wirings 71 a to71 c overlap over the gate electrode, and thus an influence byunevenness due to the gate electrode is small and reduction in coverageand generation of leakage current can be suppressed.

Further, in the case of a liquid crystal display device, the wirings 71a to 71 c which is connected to a signal line serves as a source and thewirings 71 a to 71 c which is connected to a pixel electrode serves as adrain, and by making the source have a U-shape or a C-shape (that is,the shape with an upper surface shape having a curve around the drainwith the insulating film interposed therebetween) with which a region ofthe source which faces the drain is larger than a region of the drainwhich faces the source, parasitic capacitance between the gate electrode(gate wiring) and the drain can be reduced. Therefore, a thin filmtransistor in which voltage drop in the drain electrode side is reducedcan be formed. In addition, the display device having such a structurecan have improved response speed of pixels. In particular, in the caseof thin film transistors formed in pixels in a liquid crystal displaydevice, since drop in drain voltage can be reduced, response speed of aliquid crystal material can be improved.

Through the above process, a thin film transistor and an elementsubstrate which can be used for a display device can be formed.

Although this embodiment mode describes a channel-etched thin filmtransistor, this embodiment mode can be applied to a channel-protectivethin film transistor. In specific, it is possible to form a channelprotection film over the second buffer layer and to provide the pair ofimpurity semiconductor films over the channel protection film and thesecond buffer layer.

According to this embodiment mode, a high-performance thin filmtransistor can be manufactured. Accordingly, a driving frequency of adisplay device can be increased, whereby the panel size can be increasedand high density of pixels can be achieved.

Embodiment Mode 4

In this embodiment mode, a manufacturing process for a thin filmtransistor having high field effect mobility and on-current, and lowoff-current is described. In addition, a process for manufacturing athin film transistor is described through which the number of photomaskscan be less than that in Embodiment Mode 3. Here, as a typical example,a method for manufacturing a thin film transistor of FIG. 2 inEmbodiment Mode 1 is described.

In a manner similar to that in Embodiment Mode 3, as illustrated in FIG.14A, a conductive film is formed over the substrate 50; a resist isapplied to the conductive film; and the conductive film is partly etchedusing a resist mask which is formed through a photolithography processusing the first photomask to form the gate electrode 51. Then, the gateinsulating films 52 a and 52 b are formed over the gate electrode 51.Then, the semiconductor film 58 to which an impurity element serving asa donor is added and the first buffer layer 62 are formed over the gateinsulating film 52 b through photolithography process using the secondphotomask. Then, the second buffer layer 41, the impurity semiconductorfilm 55 to which an impurity element imparting one conductivity type isadded, and the conductive films 65 a to 65 c are formed in that orderover the first buffer layer 62. Then, a resist is applied to theconductive film 65 c.

As the resist, a positive resist or a negative resist can be used. Here,a positive resist is used.

Then, the resist is irradiated with light using a multi-tone mask as athird photomask, so that the resist is exposed to the light to be aresist mask 81.

Light exposure using a multi-tone mask is described here with referenceto FIGS. 15A to 15D.

A multi-tone mask can perform three levels of light exposure to obtainan exposed portion, a half-exposed portion, and an unexposed portion;with which one-time light exposure and development process can form aresist mask with regions of plural thicknesses (typically, two kinds ofthicknesses) to be formed. Accordingly, by using a multi-tone mask, thenumber of photomasks can be reduced.

As typical examples of a multi-tone mask, a gray-tone mask 159 aillustrated in FIG. 15A and a half-tone mask 159 b illustrated in FIG.15C can be given.

As illustrated in FIG. 15A, the gray-tone mask 159 a includes alight-transmitting substrate 163 provided with a light-blocking portion164 and a diffraction grating 165. The light transmittance of thelight-blocking portion 164 is 0%. On the other hand, the diffractiongrating 165 has a light transmitting portion in a slit form, a dot form,a mesh form, or the like with intervals of equal to or less than theresolution limit of light used for the exposure, and therefore controlsthe light transmittance. The diffraction grating 165 can be in a slitform, a dot form, or a mesh form with regular intervals; or in a slitform, a dot form, or a mesh form with irregular intervals.

For the light-transmitting substrate 163, a light-transmitting substratesuch as a quartz substrate can be used. The light-blocking portion 164and the diffraction grating 165 can be formed using a light-blockingmaterial such as chromium or chromium oxide, which absorbs light.

When the gray-tone mask 159 a is irradiated with light, a lighttransmittance 166 of the light-blocking portion 164 is 0% and the lighttransmittance 166 of a region where neither the light-blocking portion164 nor the diffraction grating 165 is provided is 100% as illustratedin FIG. 15B. The light transmittance 166 of the diffraction grating 165can be controlled in a range of 10% to 70%. The light transmittance inthe diffraction grating 165 can be controlled by adjusting the intervalof slits, dots, or meshes of the diffraction grating and the pitchthereof.

As illustrated in FIG. 15C, the half-tone mask 159 b includes thelight-transmitting substrate 163 provided with a semi-light-transmittingportion 167 and a light-blocking portion 168. Thesemi-light-transmitting portion 167 can be formed using MoSiN, MoSi,MoSiO, MoSiON, CrSi, or the like. The light-blocking portion 168 can beformed using a light-blocking material such as chromium or chromiumoxide, which absorbs light.

When the half-tone mask 159 b is irradiated with light, a lighttransmittance 169 of the light-blocking portion 168 is 0% and the lighttransmittance 169 of the region where neither the light-blocking portion168 nor the semi-light-transmitting portion 167 is provided is 100% asillustrated in FIG. 15D. The light transmittance 169 of thesemi-light-transmitting portion 167 can be controlled in a range of 10%to 70%. The light transmittance in the semi-light-transmitting portion167 can be controlled by a material of the semi-light-transmittingportion 167.

After light exposure using the multi-tone mask, development is carriedout, whereby the resist mask 81 including regions having differentthicknesses can be formed, as illustrated in FIG. 14A.

Next, with the resist mask 81, the second buffer layer 41, the impuritysemiconductor film 55 to which an impurity element imparting oneconductivity type is added, and the conductive films 65 a to 65 c areetched and separated. As a result, the second buffer layer 42, theimpurity semiconductor film 63 to which an impurity element impartingone conductivity type is added, and conductive films 85 a to 85 c asillustrated in FIG. 14B can be formed.

Next, ashing is performed on the resist mask 81. As a result, the areasand the thickness of the resist are reduced. Accordingly, a region ofthe resist having a small thickness (a region overlapping with a part ofthe gate electrode 51) is removed to form a separated resist mask 86 asillustrated in FIG. 14C.

Then, the conductive films 85 a to 85 c are etched and separated usingthe resist mask 86. As a result, pairs of wirings 92 a to 92 c asillustrated in FIG. 16A, can be formed. By wet etching the conductivefilms 85 a to 85 c using the resist mask 86, the conductive films 85 ato 85 c are etched isotropically. As a result, the wirings 92 a to 92 cwith smaller areas than the resist mask 86 can be formed.

Then, the impurity semiconductor film 63 to which an impurity elementimparting one conductivity type is added is etched using the resist mask86 to form the pair of source and drain regions 88 as illustrated inFIG. 16B. Note that the second buffer layer 42 is also etched partly inthis etching step. The partly etched second buffer layer is referred toas a second buffer layer 87. Note that the second buffer layer 87 has adepressed portion. The source and drain regions and the depressedportion of the second buffer layer can be formed in the same process.Here, the second buffer layer 87 is partly etched using the resist mask86 having a smaller area than the resist mask 81; accordingly, thesecond buffer layer 87 is protruded from the source and drain regions88. In addition, the end portions of the wirings 92 a to 92 c are notaligned with those of the source and drain regions 88, and the endportions of the source and drain regions 88 are located beyond the endportions of the wirings 92 a to 92 c. After that, the resist mask 86 isremoved.

Next, dry etching may be performed under such a condition that thebuffer layer which is exposed is not damaged and an etching rate of thebuffer layer is low. Through this step, an etching residue on the bufferlayer between the source and drain regions, a residue of the resistmask, and a contamination source in the apparatus used for removal ofthe resist mask can be removed, whereby the source and drain regions canbe certainly insulated. As a result, leakage current of the thin filmtransistor can be reduced; therefore, a thin film transistor with smalloff-current and high withstand voltage can be manufactured. Note that achlorine gas may be used for an etching gas, for example.

Through the above process, a channel-etched thin film transistor 83 canbe formed. In addition, the thin film transistor can be formed using twophotomasks.

After that, through a process similar to the process in Embodiment Mode3, the protective insulating film 76 and the insulating film 102 areformed over the wiring 92 a to 92 c, the source and drain regions 88,the second buffer layer 87, and the gate insulating film 52 b, then, acontact hole is formed through a photolithography process using a fourthphotomask as illustrated in FIG. 16C.

Then, the pixel electrode 77 is formed over the insulating film 102through a photolithography process using a fifth photomask. Note thatFIG. 16C is a cross-sectional view taken along line U-V in FIG. 17.

Through the above process, an element substrate having a thin filmtransistor which can be used for a display device can be formed withphotomasks the number of which is reduced by one compared to the numberin Embodiment Mode 3.

Embodiment Mode 5

In this embodiment mode, a manufacturing process for a thin filmtransistor having high mobility and on-current, and low off-current isdescribed below. Here, as a typical example, a method for manufacturinga thin film transistor of FIG. 3 in Embodiment Mode 1 is described.

In a manner similar to that in Embodiment Mode 3, the gate electrode 51and the gate insulating films 52 a and 52 b are formed over thesubstrate 50. Then, a semiconductor film to which an impurity elementserving as a donor is added is formed over the gate insulating film 52b, and a buffer layer and an impurity semiconductor film to which animpurity element imparting one conductivity type is added are formed inthat order over the semiconductor film. Then, a resist mask 56 is formedover the impurity semiconductor film to which an impurity elementimparting one conductivity type is added, and the impurity semiconductorfilm to which an impurity element imparting one conductivity type isadded, the buffer layer, and the semiconductor film to which an impurityelement serving as a donor is added are etched, whereby thesemiconductor film 58 to which an impurity element serving as a donor isadded, the buffer layer 42, and the impurity semiconductor film 63 towhich an impurity element imparting one conductivity type is added areformed as illustrated in FIG. 18A.

Then, as illustrated in FIG. 18B, the insulating film 67 is formed overthe impurity semiconductor film 63 to which an impurity elementimparting one conductivity type is added and the gate insulating film 52b. The insulating film 67 can be formed using a material similar to thematerial for the gate insulating films 52 a and 52 b as appropriate.

Then, a resist mask 68 is formed over the insulating film 67. The resistmask 68 is provided to form an insulating film by partly etching theinsulating film 67. The insulating film is provided in a manner suchthat the wirings which are formed later are prevented from being incontact with the semiconductor film 58 to which an impurity elementserving as a donor is added, and are in contact with the impuritysemiconductor film 63 to which an impurity element imparting oneconductivity type is added. The resist mask 68 preferably has an openingwhich is smaller than an area of an upper surface of the insulating film63 to which an impurity element imparting one conductivity type isadded.

Then, as illustrated in FIG. 18C, the insulating film 67 is etched usingthe resist mask 68 to form the insulating film 67 a which covers an endportion of the impurity semiconductor film 63 to which an impurityelement imparting one conductivity type is added.

Then, as illustrated in FIG. 19A, the conductive films 65 a to 65 c areformed over the insulating film 67 a and the impurity semiconductor film63 to which the impurity element imparting one conductivity type isadded as in Embodiment Mode 3, and a resist mask 66 is formed over theconductive films 65 a to 65 c.

Then, as illustrated in FIG. 19B, the wirings 71 a to 71 c are formed byetching the conductive films 65 a to 65 c using the resist mask 66.

Then, the impurity semiconductor film 63 to which an impurity elementimparting one conductivity type is added is etched and separated usingthe resist mask 66. As a result, the pair of source and drain regions 72can be formed as illustrated in FIG. 20A. Note that in this etchingprocess, the buffer layer 42 is also partly etched. The buffer layer 42which is partly etched and has a depressed portion is referred to as thebuffer layer 73.

Through the above process, a channel-etched thin film transistor 31 canbe formed. Since the semiconductor film 58 to which an impurity elementserving as a donor is added and the wirings 71 a to 71 c are isolated bythe insulating film 67 a, leakage current between the semiconductor film58 to which an impurity element serving as a donor is added and thewirings 71 a to 71 c can be reduced. Accordingly, a thin film transistorwith low off-current can be formed.

Then, as illustrated in FIG. 20B, the protective insulating film 76 isformed over the wiring 71 c and the gate insulating film 52 b in amanner similar to that in Embodiment Mode 3. Then, the protectiveinsulating film 76 is partly etched to form a contact hole and exposethe wiring 71 c partly. Then, as illustrated in FIG. 20C, the pixelelectrode 77 is formed in the contact hole as in Embodiment Mode 3.Through the above process, an element substrate can be manufactured.

Through the above process, an element substrate having a thin filmtransistor with low off-current can be manufactured. By using theelement substrate, a display device with high contrast can bemanufactured.

Embodiment Mode 6

Next, a method for manufacturing a channel-protective thin filmtransistor, as illustrated in FIG. 4, in which leakage current can bereduced is described below.

In a manner similar to that of Embodiment Mode 3, the gate electrode 51and the gate insulating films 52 a and 52 b are formed over thesubstrate 50. Then, through a process similar to the process inEmbodiment Mode 5, a semiconductor film to which an impurity elementserving as a donor is added is formed over the gate insulating film 52b. Then, a buffer layer is formed over the semiconductor film. Then, aresist mask is formed over the buffer layer, and then the buffer layerand the semiconductor film to which an impurity element serving as adonor is added are etched to form the semiconductor film 58 to which animpurity element serving as a donor is added and the buffer layer 42.

Then, the insulating film 67 as illustrated in FIG. 18B is formed overthe buffer layer 42, and the gate insulating film 52 b. Then, a resistmask is formed over the insulating film 67 and the insulating film 67 isetched using the resist mask to form the insulating films 67 a, and 67 bas illustrated in FIG. 21A. Note that one contact hole may be formedaround the insulating film 67 b. In that case, the insulating film 67 aand the insulating film 67 b are separated. Alternatively, a pair ofcontact holes may be formed. In that case, the insulating film 67 a andthe insulating film 67 b are connected to each other. As a result, theinsulating film 67 a which covers an end portion of the buffer layer canbe formed over the buffer layer 42 as well as the insulating film 67 bwhich serves as a channel protection film in the thin film transistorwhich is completed later.

Then, the impurity semiconductor film 69 to which an impurity elementimparting one conductivity type is added is formed over the gateinsulating film 52 b, an exposed portion of the buffer layer 42, and theinsulating films 67 a and 67 b. The impurity semiconductor film 69 towhich an impurity element imparting one conductivity type is added canbe formed in a manner similar to the impurity semiconductor film 55 towhich an impurity element imparting one conductivity type is added,which is described in Embodiment Mode 3.

Then, the conductive films 65 a to 65 c are formed over the impuritysemiconductor film 69 to which an impurity element imparting oneconductivity type is added. Then, the resist mask 66 is formed over theconductive films 65 a to 65 c.

Then, as illustrated in FIG. 21B, the conductive films 65 a to 65 c areformed using the resist mask 66 to form the wirings 71 a to 71 c. Then,the impurity semiconductor film 69 to which an impurity elementimparting one conductivity type is added is etched and separated usingthe resist mask 66. As a result, the pair of source and drain regions 70can be formed as illustrated in FIG. 21B. Note that in this etchingprocess, the insulating film 67 b is also partly etched. The insulatingfilm 67 b which is partly etched and has a depressed portion is referredto as a channel protection film 67 c.

Through the above process, a channel-protective thin film transistor 32can be formed. Since the semiconductor film 58 to which an impurityelement serving as a donor is added and the pair of source and drainregions 70 are isolated by the insulating film 67 a, leakage currentbetween the semiconductor film 58 to which an impurity element servingas a donor is added and the pair of source and drain regions 70 can bereduced. Accordingly, a thin film transistor with low off-current can beformed. In addition, the channel protection film 67 c can also be formedin formation of the insulating film 67 a for reducing leakage current.

Then, the protective insulating film 76 and the pixel electrode 77 whichis in contact with the wiring 71 c through the protective insulatingfilm 76 are formed as illustrated in FIG. 21C, whereby an elementsubstrate can be manufactured.

Through the above process, an element substrate having a thin filmtransistor with low off-current can be manufactured. By using theelement substrate, a display device with high contrast can bemanufactured.

Embodiment Mode 7

Next, a method for manufacturing a thin film transistor as illustratedin FIG. 5, in which leakage current can be reduced is described below.

After forming the wirings 71 a to 71 c, which are illustrated in FIG.11C and described in Embodiment Mode 3, the wirings 92 a to 92 c, whichare illustrated in FIG. 16B and described in Embodiment Mode 4, thewirings 71 a to 71 c, which are illustrated in FIG. 19B and described inEmbodiment Mode 5, or the wirings 71 a to 71 c, which are illustrated inFIG. 4 and described in Embodiment Mode 6; the resist mask 66 or 86 isremoved. Then, the impurity semiconductor film to which an impurityelement imparting one conductivity type is added may be etched using thewirings 71 a to 71 c or the wiring 92 a to 92 c as a mask. As a result,a thin film transistor as illustrated in FIG. 5 in which end portions ofthe wirings 71 a to 71 c or 92 a to 92 c are aligned with end portionsof the source and drain region 70, 72, or 88 can be formed.

Embodiment Mode 8

Next, a method for manufacturing a thin film transistor as illustratedin FIG. 7, in which leakage current can be reduced is described below.

FIG. 7 illustrates a mode of a thin film transistor in which, instead ofthe semiconductor film 58 to which an impurity element serving as adonor is added in the thin film transistors described in EmbodimentModes 1 to 7, crystal grains 60 to which an impurity element serving asa donor is added are dispersed over the gate insulating film 52 b, andthe semiconductor film 61 containing germanium as its main component isformed over the gate insulating film 52 b and the crystal grains 60 towhich an impurity element serving as a donor is added. In addition, thebuffer layer 42 a which covers an upper surface and side surface of thesemiconductor film 61 containing germanium as its main component isformed. Since the semiconductor film containing germanium as its maincomponent has higher mobility than the crystal grains containing siliconas its main component and to which an impurity element serving as adonor is added, carriers move through the semiconductor film containinggermanium as its main component. Therefore, a film with low resistivitycan be formed over the gate insulating film 52 b.

In a manner similar to that in Embodiment Mode 3, the crystal grains 60to which an impurity element serving as a donor is added are formed asfollows. A microcrystalline semiconductor film or amorphoussemiconductor film to which an impurity element serving as a donor isadded is formed over the gate insulating film 52 b. Then, themicrocrystalline semiconductor film or amorphous semiconductor film towhich an impurity element serving as a donor is added is exposed toplasma to form the crystal grains 60. As plasma, any one or more ofhydrogen, fluorine, and fluoride gas are introduced into a reactionchamber of a plasma CVD apparatus, then, a high-frequency power isapplied to generate plasma.

Any one or more of fluorine, a fluoride gas, and hydrogen areintroduced, and high-frequency power is applied, whereby hydrogen plasmaor fluorine plasma is generated. Hydrogen plasma introduces hydrogen toa reaction chamber so that plasma is generated. The fluorine plasmaintroduces fluorine or a fluoride gas to a reaction chamber so thatplasma is generated. As examples of a fluoride gas, HF, SiF₄, SiHF₃,SiH₂F₂, SiH₃F, Si₂F₆, GeF₄, GeHF₃, GeH₂F₂, GeH₃F, Ge₂F₆, and the likeare given. Note that, as well as fluorine, a fluoride gas, or hydrogen,a rare gas may be introduced to a reaction chamber so that rare gasplasma is generated.

Hydrogen radicals or fluorine radicals are generated in plasma byhydrogen plasma, fluorine plasma, or the like. The hydrogen radicalsreact with an amorphous component in a microcrystalline semiconductorfilm or an amorphous semiconductor film to which an impurity elementserving as a donor is added to crystallize a part of the semiconductorfilm and to etch the amorphous component. The fluorine radicals etch anamorphous component in the microcrystalline semiconductor film or theamorphous semiconductor film to which an impurity element serving as adonor is added. Accordingly, crystal grains with high crystallinity canbe left. In the case where an amorphous semiconductor film to which animpurity element serving as a donor is formed over the gate insulatingfilm 52 b, an amorphous semiconductor component is etched and partlycrystallized to form crystal grains. Thus, an amorphous semiconductorcomponent at an interface with the gate insulating film is also etchedby plasma. Accordingly, crystal grains having high crystallinity can beformed over the gate insulating film.

As for a method for generating plasma, the HF band (3 MHz to 30 MHz,typically 13.56 MHz or 27.12 MHz) or the VHF band of more than 30 MHz toabout 300 MHz, typically 60 MHz is preferably used. Further,high-frequency plasma with a frequency of, for example, 1 GHz or 2.45GHz can be used. In particular, by using high-frequency power of 13.56MHz, uniformity of plasma can be increased. Thus, a germanium film canbe exposed to plasma with high uniformity even over a large-sizedsubstrate of the sixth to tenth generations. This is favorable for massproduction.

Then, a film containing germanium as its main component over the crystalgrains, adhesion between the crystal grains and the film containinggermanium as its main component can be improved. Further, amicrocrystalline germanium film can be formed as the semiconductor film61 containing germanium as its main component can be formed by crystalgrowth using the crystal grains as crystal nucleus.

In the case of forming the semiconductor film 61 containing germanium asits main component by a CVD method, together with hydrogen, a depositiongas containing germanium is introduced into a reaction chamber of aplasma CVD apparatus and high-frequency power is applied to generateplasma, thus an amorphous germanium film or a microcrystalline germaniumfilm is formed as the semiconductor film 61 containing germanium as itsmain component. Alternatively, together with hydrogen and a depositiongas containing germanium, a deposition gas containing silicon is used toform an amorphous silicon germanium film or a microcrystalline silicongermanium film.

Note that one mode for forming an amorphous germanium film as asemiconductor film 61 containing germanium as its main component is thatan amorphous germanium film can be formed by glow discharge plasma usinga deposition gas containing germanium in a reaction chamber.Alternatively, a deposition gas containing germanium is diluted with oneor plural kinds of rare gas elements selected from helium, argon,krypton, and neon, and thus an amorphous germanium film can be formed byglow discharge plasma. Further alternatively, an amorphous germaniumfilm can be formed by glow discharge plasma using hydrogen with a flowrate of 1 or more and 10 or less times, preferably 1 or more and 5 orless times a flow rate of a deposition gas containing germanium.Further, by using a deposition gas containing silicon together withhydrogen and a deposition gas containing germanium, an amorphous silicongermanium film can be formed as the semiconductor film 61 containinggermanium as its main component.

Further, another mode for forming a microcrystalline amorphous germaniumfilm as the semiconductor film 61 containing germanium as its maincomponent is that a deposition gas containing germanium, which isgermane here, and hydrogen and/or a rare gas are mixed in a reactionchamber, and a microcrystalline germanium film is formed by glowdischarge plasma. Germane is diluted 10-folds to 2000-folds withhydrogen and/or a rare gas. Thus, a large amount of hydrogen and/or arare gas is necessary. The substrate heating temperature is 100° C. to400° C., preferably 250° C. to 350° C. Further, by using a depositiongas containing silicon together with hydrogen and a deposition gascontaining germanium, a microcrystalline silicon germanium film isformed as the semiconductor film 61 containing germanium as its maincomponent.

In the process of forming the semiconductor film 61 containing germaniumas its main component, glow discharge plasma is generated by applyinghigh-frequency power with a frequency of 1 MHz, to 30 MHz, typically13.56 MHz or 27.12 MHz, or high-frequency power with a frequency in theVHF band of more than 30 MHz to about 300 MHz, typically 60 MHz.Further, high-frequency plasma with a frequency of, for example, 1 GHzor 2.45 GHz can be used.

After forming the crystal grains to which an impurity element serving asa donor is added and the semiconductor film containing germanium as itsmain component, instead of the semiconductor film 45 to which animpurity element serving as a donor is added and the first buffer layer54 which are described in Embodiment Mode 3, the thin film transistorillustrated in FIG. 7 can be manufactured in a process similar to thatin Embodiment Mode 3. Further, a thin film transistor can be formed in aprocess similar to that in any of Embodiment modes 4 to 7.

Embodiment Mode 9

In this embodiment mode, manufacture of a thin film transistor havinghigh field effect mobility and on-current, and low off-current isdescribed below. Here, a manufacturing process for a thin filmtransistor of FIG. 1B is described below.

As illustrated in FIG. 22A, the gate electrode 51 and a capacitor wiring57 are formed over the substrate 50, and the gate insulating films 52 aand 52 b are formed over the gate electrode 51 and the capacitor wiring57.

Then, the semiconductor film 45 to which an impurity element serving asa donor is added is formed over the gate insulating film 52 b. Here, asa mode of the semiconductor film 45 to which an impurity element servingas a donor is added, a microcrystalline silicon film containingphosphorus is formed.

Then, the first buffer layer 54 is formed. As the first buffer layer 54,an amorphous semiconductor film can be formed. As an amorphoussemiconductor film, an amorphous silicon film, amorphous silicongermanium film, or the like can be given.

The thickness of the first buffer layer 54 is 10 nm to 100 nm,preferably 30 nm to 50 nm.

By forming an amorphous semiconductor film, or, an amorphoussemiconductor film containing hydrogen, nitrogen, or a halogen as thefirst buffer layer 54 on the surface of the semiconductor film 45 towhich an impurity element serving as a donor is added, surfaces ofcrystal grains contained in the semiconductor film 45 to which animpurity element serving as a donor is added can be prevented from beingoxidized naturally. In particular, in a region where an amorphoussemiconductor is in contact with microcrystalline grains, a crack islikely to be caused due to local stress. When this crack is exposed tooxygen, the crystal grains are oxidized, whereby silicon oxide isformed. However, by forming the first buffer layer 54 on the surface ofthe semiconductor film 45 to which an impurity element serving as adonor is added, the microcrystalline grains can be prevented from beingoxidized.

In addition, it is preferable that the first buffer layer 54 be formedby a plasma CVD method at a temperature of 300° C. to 400° C. afterforming the semiconductor film 45 to which an impurity element servingas a donor is added. This film formation treatment supplies hydrogen tothe semiconductor film 45, and the same effect as hydrogenating thesemiconductor film 45 can be obtained. In other words, by depositing thefirst buffer layer 54 over the semiconductor film 45 to which animpurity element serving as a donor is added, hydrogen is diffused intothe semiconductor film 45 to which an impurity element serving as adonor is added, whereby dangling bonds can be terminated.

Then, a resist is applied over the first buffer layer 54, then, theresist is exposed to light and developed through a photolithographyprocess using a second photomask to form a resist mask. Then, using theresist mask, the first buffer layer 54 and the semiconductor film 45 towhich an impurity element serving as a donor is added are etched to formthe first buffer layer 62 and the semiconductor film 58 to which animpurity element serving as a donor is added. Then, the resist mask isremoved (see FIG. 22B). Note that FIG. 22B is a cross-sectional viewtaken along line Q-R in FIG. 25A.

Then, as illustrated in FIG. 22C, the second buffer layer 41 and theimpurity semiconductor film 55 to which an impurity element impartingone conductivity type is added are formed over the first buffer layer 62and the gate insulating film 52 b.

The second buffer layer 41 is formed in a manner similar to that of thefirst buffer layer 54. In some cases, the second buffer layer 41 ispartly etched in a later step of formation of source and drain regions,and therefore is preferably formed with a thickness such that the secondbuffer layer 41 is partly left after the etching. Typically, it ispreferable to form the second buffer layer 41 with a thickness of 30 nmor more and 500 nm or less, preferably 50 nm or more and 200 nm or less.

In a display device in which high voltage (e.g., about 15 V) is appliedto thin film transistors, typically, in a liquid crystal display device,if the first buffer layer 54 and the second buffer layer 41 are formedthick, withstand voltage is increased. Therefore, deterioration of thethin film transistors can be prevented even if high voltage is appliedto the thin film transistors.

Since the first buffer layer 54 and the second buffer layer 41 areformed using an amorphous semiconductor film or an amorphoussemiconductor film containing hydrogen or a halogen, the first bufferlayer 54 and the second buffer layer 41 have a larger energy gap thanthe semiconductor film 45 to which an impurity element is added, andhigher resistivity. In addition the mobility of the first buffer layer54 and the second buffer layer 41 is as low as one-fifth to one-tenth ofthat of the semiconductor film 45. Therefore, in a thin film transistorwhich is completed later, the first buffer layer and the second bufferlayer, which are formed between the source and drain regions and thesemiconductor film 45 to which an impurity element serving as a donor isadded, serve as high resistance regions and the semiconductor film 45 towhich an impurity element is added serves as a channel formation region;therefore, off-current of the thin film transistor can be reduced. Whenthe thin film transistor is used as a switching element in a displaydevice, the contrast of the display device can be improved.

If an n-channel thin film transistor is formed, phosphorus, which is atypical impurity element, may be added to the impurity semiconductorfilm 55 to which an impurity element imparting one conductivity type isadded; for example, an impurity gas such as PH₃ may be added to adeposition gas containing silicon or germanium. If a p-channel thin filmtransistor is formed, boron, which is a typical impurity element, may beadded; for example, a gas containing an impurity element such as B₂H₆may be added to a gas which contains a deposition gas containing siliconor germanium.

Then, a resist mask is formed over the impurity semiconductor film 55 towhich an impurity element imparting one conductivity type is added. Theresist mask is formed by a photolithography technique. Here, a resistwhich is applied over the impurity semiconductor film 55 to which animpurity element imparting one conductivity type is added is exposed tolight and developed using a third photomask to form the resist mask.

Then, using the resist mask, the second buffer layer 41 and the impuritysemiconductor film 55 to which an impurity element imparting oneconductivity type is added are etched and separated to form the secondbuffer layer 42 and the impurity semiconductor film 63 to which animpurity element imparting one conductivity type is added as illustratedin FIG. 23A. Then, the resist mask is removed. Note that FIG. 25B is across-sectional view taken along line Q-R in FIG. 25B.

The second buffer layer 42 covers the semiconductor film 58 to which animpurity element serving as a donor is added, whereby leakage currentbetween source and drain regions formed over the second buffer layer 42between the semiconductor film 58 can be prevented. In addition, leakagecurrent between a wiring and the semiconductor film 58 can be prevented.

Then, as illustrated in FIG. 23B, the conductive films 65 a to 65 c areformed over the impurity semiconductor film 63 to which an impurityelement imparting one conductivity type is added and the gate insulatingfilm 52 b.

The conductive films 65 a to 65 c can be formed using any of the metalmaterials which are listed as materials for the wirings 71 a to 71 c inthe above embodiment modes.

Then, a resist mask is formed over the conductive film 65 c through aphotolithography process using a fourth photomask.

Then, the conductive films 65 a to 65 c are etched using the resist maskto form the pairs of the wirings 71 a to 71 c (which serve as source anddrain electrode) as illustrated in FIG. 23C.

Then, the impurity semiconductor film 63 to which an impurity elementimparting one conductivity type is added is etched and separated usingthe resist mask. As a result, the pair of source and drain regions 72can be formed as illustrated in FIG. 23C. Note that in this etchingprocess, the second buffer layer 42 is also partly etched. The secondbuffer layer 42 which is partly etched and has a depressed portion isreferred to as the second buffer layer 43. The source and drain regionsand the depressed portion of the buffer layer can be formed in the sameprocess. The depth of the depressed portion of the second buffer layer43 is set to half to one-third of the thicknesses of the thickest regionin the second buffer layer 43, whereby the source region and the drainregion can be spaced apart from each other. Accordingly, leakage currentbetween the source region and drain region can be reduced. Then, theresist mask is removed.

Next, dry etching may be performed under such a condition that thesecond buffer layer 43 which is exposed is not damaged and an etchingrate of the second buffer layer 43 is low. Through this step, an etchingresidue on the second buffer layer 43 between the source and drainregions, a residue of the resist mask, and a contamination source in theapparatus used for removal of the resist mask can be removed, wherebythe source and drain regions can be certainly insulated. As a result,leakage current of the thin film transistor can be reduced; therefore, athin film transistor with small off-current and high withstand voltagecan be manufactured. Note that a chlorine gas may be used for an etchinggas, for example.

Note that FIG. 23C is a cross-sectional view taken along line Q-R inFIG. 25C. As illustrated in FIG. 25C, the end portion of the source anddrain regions 72 is located beyond the end portion of the wiring 71 c.Furthermore, one of the pair of wirings surrounds the other wirings(specifically, the former wiring is in a U-shape or a C-shape). Thus, anarea in which carriers travel can be increased, and thus the amount ofcurrent can be increased and an area of the thin film transistor can bereduced. In addition, the microcrystalline semiconductor film and thewirings overlap over the gate electrode, and thus an influence byunevenness due to the gate electrode is small and reduction in coverageand generation of leakage current can be suppressed.

Through the above process, a channel-etched thin film transistor 74 canbe formed.

Next, as illustrated in FIG. 24A, a protective insulating film 76 isformed over the wirings 71 a to 71 c, the source and drain regions 72,the second buffer layer 43, and the gate insulating film 52 b.

Then, the insulating film 101 is formed over the protective insulatingfilm 76. The insulating film 101 is formed using a photosensitiveorganic resin here. Then, the insulating film 101 is exposed to lightand developed using a fifth photomask to form the insulating film 102which exposes the protective insulating film 76. Then, the protectiveinsulating film 76 is etched using the insulating film 102 to form thecontact hole 111 which partly exposes the wiring 71 c and a contact hole112 which partly exposes the gate insulating film 52 b over thecapacitor wiring 57 (see FIG. 24B).

Then, as illustrated in FIG. 24C, the pixel electrode 77 is formed inthe contact holes 111 and 112. In addition, a capacitor 105 includingthe capacitor wiring 57, the gate insulating films 52 a and 52 b, theprotective insulating film 76, and the pixel electrode 77 can be formed.Here, after a conductive film is formed over the insulating film 102,the conductive film is etched using a resist mask which is formedthrough a photolithography process using a sixth photomask, whereby thepixel electrode 77 is formed. Note that FIG. 24C is a cross-sectionalview taken along line Q-R in FIG. 25D.

Through the above process, a thin film transistor and an elementsubstrate which can be used for a display device can be formed.

Since the channel formation region of the thin film transistor which isformed in this embodiment mode is formed of a microcrystallinesemiconductor film, a driving frequency of a display device can beincreased, whereby the panel size can be increased and high density ofpixels can be achieved. Furthermore, the thin film transistors can bemanufactured over a large-area substrate.

Although this embodiment mode describes a channel-etched thin filmtransistor, this embodiment mode can be applied to a channel-protectivethin film transistor. In specific, it is possible to form a buffer layerwhich covers the microcrystalline semiconductor film to which animpurity element serving as a donor is added.

Embodiment Mode 10

This embodiment mode describes a mode in which a gate electrode and acapacitor wiring of a thin film transistor included in a semiconductordevice described in the above embodiment modes have a different shape.Except the shape, the thin film transistor can be formed in a mannersimilar to that in the above embodiment modes; accordingly, repetitivedescription of the same components or components having functionssimilar to those of above embodiment modes and repetitive description ofsimilar process will be omitted.

A semiconductor device of this embodiment mode is illustrated in FIG.26. In FIG. 26, the gate electrode 51 a and a capacitor wiring 57 a hasa step in their end portions. By providing the gate electrode 51 a andthe capacitor wiring 57 a having a step in their end portions, coveragewith the gate insulating film and the microcrystalline semiconductorfilm to which an impurity element serving as a donor is added can beimproved. In addition, breaking of those layers due to level differencescan be prevented; accordingly, a yield can be improved.

In this embodiment mode, an example in which light exposure using amulti-tone (high-tone) mask is performed to form a resist mask forforming the gate electrode 51 a and the capacitor wiring 57 a isdescribed. As a resist, a positive resist or a negative resist can beused. Here, a positive resist is used.

A multi-tone mask can perform three levels of light exposure to obtainan exposed portion, a half-exposed portion, and an unexposed portion. Amulti-tone mask is a mask through which light is transmitted to have aplurality of intensities. One-time light exposure and developmentprocess can form a resist mask with regions of plural thicknesses(typically, two kinds of thicknesses) to be formed. Accordingly, byusing a multi-tone mask, the number of photomasks can be reduced.

As typical examples of a multi-tone mask, there are a gray-tone mask, ahalf-tone mask, and the like. FIGS. 27A to 27C are plan viewsillustrating gray-tone masks 265, 266, and 267 which can be employed inthe present invention.

The gray-tone mask 265 in FIG. 27A includes a diffraction gratingportion 265 a and a light-blocking portion 265 b. The diffractiongrating portions 265 a are provided so as to make tapered projections atboth sides of the light-blocking portion 265 b.

The gray-tone mask 266 in FIG. 27B includes a diffraction gratingportion 266 a and a light-blocking portion 266 b. The diffractiongrating portions 266 a have rectangular shapes and are provided likebranches at both sides of the light-blocking portion 266 b.

The gray-tone mask 267 in FIG. 27C includes a diffraction gratingportion 267 a and a light-blocking portion 267 b. The diffractiongrating portions 267 a have rectangular shapes and are provided parallelto the light-blocking portion 267 at both sides of the light-blockingportion 267 b.

A gray-tone mask includes a light-transmitting substrate (notillustrated), provided with a light-blocking portion and a diffractiongrating. A light transmittance of the light-blocking portions 265 b, 266b, and 267 b is 0% and a light transmittance of a region where neitherthe light-blocking portions 265 b, 266 b, and 267 b nor the portion 265a, 266 a, and 267 a is provided is 100%. On the other hand, thediffraction grating portions 265 a, 266 a, and 267 a have alight-transmitting portion in a slit form, a dot form, a mesh form, orthe like with intervals of equal to or less than the resolution limit oflight used for the exposure, and therefore controls the lighttransmittance. The diffraction grating portions can be in a slit form, adot form, or a mesh form with regular intervals; or in a slit form, adot form, or a mesh form with irregular intervals. The lighttransmittance of the diffraction grating portion can be controlled in arange of 10% to 70%. The light transmittance in the diffraction gratingportion can be controlled by adjusting the interval of slits, dots, ormeshes of the diffraction grating portion and the pitch thereof.

For the light-transmitting substrate, a light-transmitting substratesuch as a quartz substrate can be used. The light-blocking portion andthe diffraction grating portion can be formed using a light-blockingmaterial such as chromium or chromium oxide, which absorbs light.

After light exposure using the multi-tone mask such as the gray-tonemasks 265, 266, and 267, development is carried out, whereby a resistmask 231 including regions having different thicknesses can be formed,as illustrated in FIG. 27D.

By etching a conductive film using the resist mask 231 including regionshaving different thicknesses, the gate electrode 51 a and the capacitorwiring 57 a having a step in their end portions can be formed asillustrated in FIG. 26. Thus, breaking of the gate insulating film whichis formed over the gate electrode 51 a and the capacitor wiring 57 a dueto a large step can be prevented.

Note that while this embodiment mode describes an example in which thegate electrode has two steps, the gate electrode may have a plurality ofsteps such as three or four steps. In addition, while this embodimentmode describes an example in which a multi-tone mask is used for formingthe gate electrode and the capacitor wiring, a multi-tone mask can beused for another portion (such as a semiconductor film or anotherwiring) of a semiconductor device.

This embodiment mode can be combined with any of the above embodimentmodes as appropriate.

A resist mask which is formed using a multi-tone mask as a photomask hasa shape with a plurality of thicknesses. Accordingly, the number ofphotomasks and corresponding photolithography steps can be reduced,whereby simplification of process can be realized.

Embodiment Mode 11

In this embodiment mode, a preferred mode of Embodiment Modes 1 to 8 isdescribed with reference to FIGS. 31A and 31B.

FIG. 31A illustrates one mode of a thin film transistor of the presentinvention. FIG. 31B is an enlarged view 44 of an upper portion of thebuffer layer 42.

In the present invention, the buffer layer 42 has a depressed portion inits upper portion. This is because in formation of the pair of sourceand drain regions 72 by etching an impurity semiconductor film to whichan impurity element imparting one conductivity type is added, the bufferlayer is also partly etched. In an etching step for forming the pair ofsource and drain regions 72, it is preferable to perform anisotropicetching. As anisotropic etching, reactive ion beam etching (RIBE) usingelectronic cyclotron resonance (ECR) plasma, inductively coupled plasma(ICP) etching, or the like may be used. As a result, the depressedportion of the buffer layer 42 has a side surface 42 c having an angleof 70° or more and 90° or less, preferably 80° or more and 90° or lessto the substrate surface, whereby etching damage to the side surface 42c in the depressed portion can be reduced.

The side surface 42 c of the depressed portion of the buffer layer 42 isa region where carriers flow when positive or negative voltage isapplied to the gate electrode 51. In this region, if there is a fewdefects due to etching damage, carriers are not easily trapped and caneasily move when positive voltage is applied to the gate electrode 51.Therefore, on-current and field effect mobility can be improved, whichis preferable.

With the above-described structure, a thin film transistor with higheron-current and higher field effect mobility can be manufactured.

Embodiment Mode 12

In this embodiment mode, a step before formation of the semiconductorfilm 45 to which an impurity element serving as a donor is added asdescribed in Embodiment Modes 3 to 11 is described below. Here,Embodiment Mode 3 is used for description as a typical example, but thisembodiment mode can be applied to any of Embodiment Modes 4 to 11 asappropriate.

As illustrated in FIG. 10A, the gate electrode 51 is formed over thesubstrate 50, and the gate insulating films 52 a and 52 b are formedover the gate electrode 51.

Next, a surface of the gate insulating film 52 b is subjected to plasmatreatment. Typically, the surface of the gate insulating film 52 b isexposed to plasma, such as hydrogen plasma, ammonia plasma, heliumplasma, argon plasma, or neon plasma. As plasma treatment, a substrateprovided with the gate insulating film 52 b is placed in a reactionchamber. In addition, a gas such as hydrogen, ammonia, helium, argon, orneon is introduced into the reaction chamber, and glow discharge iscarried out, whereby plasma such as hydrogen plasma, ammonia plasma,helium plasma, argon plasma, or neon plasma is generated and a surfaceof the gate insulating film can be exposed to the plasma.

By exposing the surface of the gate insulating film 52 b to plasma suchas hydrogen plasma, ammonia plasma, helium plasma, argon plasma, or neonplasma, defects of the surface of the gate insulating film can bereduced. Typically, dangling bonds on the surface of the gate insulatingfilm 52 b can be terminated. Then, the semiconductor film to which animpurity element serving as a donor is added is formed, thus, defects atthe interface of the gate insulating film 52 b and the semiconductorfilm to which an impurity element serving as a donor is added can bereduced. Accordingly, trapping of carriers by defects can be reduced,whereby on-current can be improved.

Embodiment Mode 13

In this embodiment mode, a film formation apparatus which can be used ina film formation process of the above embodiment modes and flow of asubstrate therein are described below.

Next, as an example of a plasma CVD apparatus which can be used for afilm formation process of this embodiment mode, a structure suitable forforming a gate insulating film, a semiconductor film to which animpurity element serving as a donor is added, a buffer layer, and animpurity semiconductor film to which an impurity element imparting oneconductivity type is added is described.

FIG. 28 illustrates an example of a multi-chamber plasma CVD apparatushaving a plurality of reaction chambers. The apparatus is provided witha common chamber 423, a load/unload chamber 422, a first reactionchamber 400 a, a second reaction chamber 400 b, a third reaction chamber400 c, and a fourth reaction chamber 400 d. This apparatus is a singlewafer-processing type in which a substrate set in a cassette in theload/unload chamber 422 is transferred to/from each reaction chamber bya transfer mechanism 426 in the common chamber 423. A gate valve 425 isprovided between the common chamber 423 and each chamber so thattreatment performed in the chambers does not interfere with each other.

The reaction chambers are classified according to the kinds of thinfilms to be formed. For example, an insulating film such as a gateinsulating film, a semiconductor film to which an impurity elementserving as a donor is added, a buffer layer which serves as a highresistance region of a thin film transistor, and an impuritysemiconductor film to which an impurity element imparting oneconductivity type is added and which forms a source and a drain areformed in the first reaction chamber 400 a, in the second reactionchamber 400 b, the third reaction chamber 400 c, and in the fourthreaction chamber 400 d, respectively. Needless to say, the number ofreaction chambers is not limited to four and may be increased ordecreased as necessary.

A turbo-molecular pump 419 and a dry pump 420 are connected to eachreaction chamber as an evacuation means. The evacuation means is notlimited to a combination of these vacuum pumps and can employ othervacuum pumps as long as they can evacuate the reaction chamber to apressure of about 10⁻¹ Pa to 10⁻⁵ Pa. A butterfly valve 417 which caninterrupt vacuum evacuation is provided between the evacuation means andeach reaction chamber. A conductance valve 418 can control an evacuationspeed to adjust the pressure in each reaction chamber.

Note that the second reaction chamber 400 b in which a semiconductorfilm to which an impurity element serving as a donor is added is formedmay be connected to a cryopump 421 which performs vacuum evacuation toan ultra-high vacuum. By using the cryopump 421, the reaction chambercan be evacuated to an ultra-high vacuum with a pressure of lower than10⁻⁵ Pa. In this embodiment mode, by setting the pressure in thereaction chamber at an ultra-high vacuum of lower than 10⁻⁵ Pa, theoxygen concentration and the nitrogen concentration in the semiconductorfilm to which an impurity element serving as a donor is added can beeffectively reduced. Consequently, the oxygen concentration in thesemiconductor film 45 to which an impurity element serving as a donor isadded can be 1×10¹⁶ atoms/cm³ or lower. In the case where thesemiconductor film to which an impurity element serving as a donor isadded is a microcrystalline semiconductor film, by reducing the oxygenconcentration and the nitrogen concentration in the microcrystallinesemiconductor film, defects in the film can be reduced and crystallinitycan be improved and thus carrier mobility can be improved.

A gas supply means 408 includes a cylinder 410 filled with a gas usedfor the process, such as a rare gas or a semiconductor source gastypified by a silane and germane, stop valves 411 and 412, a mass flowcontroller 413, and the like. A gas supply means 408 g is connected tothe first reaction chamber 400 a and supplies a gas for forming a gateinsulating film. A gas supply means 408 i is connected to the secondreaction chamber 400 b and supplies a gas for a semiconductor film towhich an impurity element serving as a donor is added. A gas supplymeans 408 b is connected to the third reaction chamber 400 c andsupplies a gas for a buffer layer. A gas supply means 408 n is connectedto the fourth reaction chamber 400 d and supplies a gas for forming ann-type semiconductor film, for example. In addition, phosphine, which isone of gases including an impurity element which serves as a donor mayalso be supplied to the first reaction chamber 400 a and the secondreaction chamber 400 b. A gas supply means 408 a supplies hydrogen, anda gas supply means 408 f supplies an etching gas for cleaning of theinside of the reaction chambers. The gas supply means 408 a and 408 fare provided in common for the reaction chambers.

A high-frequency power supply means for generating plasma is connectedto each reaction chamber. The high-frequency power supply means includesa high-frequency power source 404 and a matching box 406.

Each reaction chamber can be used independently for forming a differentkind of thin film. Each thin film has an optimum temperature forformation. By forming each thin film in a different reaction chamber,film formation temperatures can be easily controlled. Further, the samekind of films can be repeatedly formed in one reaction chamber;therefore, an influence of residual impurities of a film which has beenformed can be eliminated. In particular, in the case of thesemiconductor film to which an impurity element serving as a donor isadded, it is possible to prevent the impurity element serving as a donorfrom mixing into a buffer layer. Consequently, the concentration of theimpurity element in the buffer layer can be decreased, wherebyoff-current of the thin film transistor can be decreased.

Then, a mode of a plasma CVD apparatus in which a gate insulating film,a semiconductor film to which an impurity element serving as a donor isadded, a buffer layer, an impurity semiconductor film to which animpurity element imparting one conductivity type is added are formedsuccessively in one reaction chamber is described with reference to FIG.29.

The apparatus is provided with the common chamber 423, the load/unloadchamber 422, a waiting chamber 401, and the reaction chamber 400 a. Thisapparatus is a single wafer-processing type in which a substrate set ina cassette in the load/unload chamber 422 is transferred to/from eachreaction chamber by the transfer mechanism 426 in the common chamber423. The gate valve 425 is provided between the common chamber 423 andeach chamber so that treatments performed in different reaction chambersdo not interfere with each other.

The turbo-molecular pump 419 and the dry pump 420 are connected to thereaction chamber 400 a as an evacuation means 430. The evacuation means430 is not limited to a combination of these vacuum pumps and can employother vacuum pumps as long as they can evacuate the reaction chamber toa pressure of about 10⁻¹ Pa to 10⁻⁵ Pa. The butterfly valve 417 whichcan interrupt vacuum evacuation is provided between the evacuation means430 and the reaction chamber. The conductance valve 418 can control anevacuation speed to adjust the pressure in each reaction chamber.Further, the cryopump 421 may be connected to the reaction chamber 400a.

A gas supply means 408 includes the cylinder 410 filled with a gas usedfor the process, such as hydrogen or a semiconductor source gas typifiedby a silane and germane, the stop valves 411 and 412, the mass flowcontroller 413, and the like. The gas supply means 408 g, 408 i, 408 a,408 n, and 408 f are connected to the reaction chamber 400 a.

The high-frequency power supply means 403 for generating plasma isconnected to the reaction chamber. The high-frequency power supply means403 includes the high-frequency power source 404 and the matching box406.

Then, a process for forming a plurality of films successively with theplasma CVD apparatus illustrated in FIG. 29 is described with referenceto FIGS. 30A to 30C.

FIG. 30A illustrates the plasma CVD apparatus of FIG. 29 in a simplifiedmanner. FIG. 30B is a schematic diagram of a process for successivelyforming a gate insulating film and a semiconductor film to which animpurity element serving as a donor is added (here, referred to as ann⁻μc-Si-film) over a substrate provided with a gate electrode. An arrowof a dotted line indicates flow of the substrate and an arrow of a solidline indicates flow of the film-forming process.

As illustrated in FIG. 30B, an inner wall of the reaction chamber 400 ais cleaned with fluorine radicals or the like (S461) to remove residualimpurities in the reaction chamber 400 a. Then, the inner wall of thereaction chamber 400 a is coated with a film which is similar to thegate insulating film (S462). Due to this coating step, metals which formthe reaction chamber 400 a can be prevented from mixing into the gateinsulating film as impurities.

Then, the substrate set in a cassette in the load/unload chamber 422 istransferred to the reaction chamber 400 a by the transfer mechanism 426in the common chamber 423 as indicated by an arrow a1. Then, a gateinsulating film, which is a silicon oxynitride film here, is formed overthe substrate in the reaction chamber 400 a (S463).

Then, the substrate over which the gate insulating film is formed istransferred to the waiting chamber 401 by the transfer mechanism 426 inthe common chamber 423 as indicated by an arrow a2, then, the substrateis kept in a waiting state (S464). Then, the inner wall of the reactionchamber 400 a is cleaned with fluorine radicals or the like (S465) toremove residual impurities in the reaction chamber 400 a. Then, theinner wall of the reaction chamber 400 a is coated with an amorphoussemiconductor film (S466). Due to this cleaning and coating, components(oxygen, nitrogen, or the like) of the gate insulating film which aredeposited on the inner wall of the reaction chamber 400 a and metalswhich form the reaction chamber 400 a can be prevented from mixing, asimpurities, into the semiconductor film to which an impurity elementserving as a donor is added. In addition, in the case where thesemiconductor film to which an impurity element serving as a donor isadded is a microcrystalline semiconductor film, the crystallinity of themicrocrystalline semiconductor film can be improved. Then, the substrateis transferred to the reaction chamber 400 a by the transfer mechanism426 in the common chamber 423, as indicated by an arrow a3, to form thesemiconductor film to which an impurity element serving as a donor isadded in the reaction chamber 400 a (S467). Here, as the semiconductorfilm to which an impurity element serving as a donor is added, a silane,hydrogen, and phosphine are used as a source gas, and a microcrystallinesilicon film to which phosphorus is added is formed.

Then, the substrate over which the semiconductor film to which animpurity element serving as a donor is added is formed is transferred tothe waiting chamber 401 by the transfer mechanism 426 in the commonchamber 423 as indicated by the arrow a2, then, the substrate is kept ina waiting state (S470). Then, the inner wall of the reaction chamber 400a is cleaned with fluorine radicals or the like (S468) to removeresidual impurities in the reaction chamber 400 a. Then, the inner wallof the reaction chamber 400 a is coated with an amorphous semiconductorfilm (S469). Due to this cleaning and coating, components (phosphorus)of the semiconductor film to which an impurity element serving as adonor is added which are deposited on the inner wall of the reactionchamber 400 a and metals which form the reaction chamber 400 a can beprevented from mixing, as impurities, into the amorphous semiconductorfilm which is formed later. Accordingly, the amorphous semiconductorfilm can serve as a high resistance region. Then, the substrate istransferred to the reaction chamber 400 a by the transfer mechanism 426in the common chamber 423, as indicated by the arrow a3, to form anamorphous semiconductor film as the first buffer layer in the reactionchamber 400 a (S471). Here, as the amorphous semiconductor film, asilane and hydrogen are used as a source gas, and an amorphoussemiconductor film is formed.

Then, the substrate over which the first buffer layer is formed is setin the cassette in the load/unload chamber 422 by the transfer mechanism426 in the common chamber 423, as indicated by an arrow a4. Through theabove process, the gate insulating film, the semiconductor film to whichan impurity element serving as a donor is added, and the first bufferlayer are successively formed over the substrate provided with a gateelectrode. Then, the inner wall of the reaction chamber 400 a is cleanedwith fluorine radicals or the like (S472) to remove residual impuritiesin the reaction chamber 400 a. Then, the inner wall of the reactionchamber 400 a is coated with a film which is similar to the gateinsulating film (S473). Then, another substrate which is set in thecassette in the load/unload chamber 422 is transferred to the reactionchamber 400 a, and the steps similar to the above steps are performed onthe substrate, starting with film formation of a gate insulating film(S463), to successively form the gate insulating film, a semiconductorfilm to which an impurity element serving as a donor is added, and afirst buffer layer.

After the gate insulating films, the semiconductor films to which animpurity element serving as a donor is added, and the first bufferlayers are formed over all the substrates which are set in the cassettein the load/unload chamber 422, the cassette is transferred from theload/unload chamber 422 to be subjected to a next process.

Note that although the substrate over which the gate insulating film andthe n⁻μc-Si-film is formed is kept in a waiting state in the waitingchamber 401, the substrate may be kept in a waiting state in theload/unload chamber 422. Thus, the plasma CVD apparatus can besimplified and cost can be reduced.

Further, as a method for forming the n⁻μc-Si-film, phosphine is used asa source gas in S467 here. However, instead of this, after the coatingS466, phosphine may be fed into the reaction chamber so that phosphorusis adsorbed onto the inner wall of the reaction chamber, then, thesubstrate kept in a waiting state in the waiting chamber 401 istransferred to the reaction chamber 400 a and a semiconductor film isformed using a source gas. The film is formed while taking in phosphoruswhich is adsorbed in the reaction chamber. Thus, a semiconductor film towhich an impurity element serving as a donor is added can be formed.

Further, in formation of the gate insulating film in S463, phosphine maybe mixed into a source gas. In that case, after the gate insulating filmto which phosphorus is added is formed, by depositing a semiconductorfilm using a source gas in S467, a semiconductor film to which animpurity element serving as a donor is added can be formed.

Next, a process in which a second buffer layer and an impuritysemiconductor film to which an impurity element imparting oneconductivity type is added (here, referred to as an n⁺a-Si-film) aresuccessively formed over the semiconductor film to which an impurityelement serving as a donor is added and the first buffer layer which areprocessed into island-shape is described with reference to FIG. 30C. Anarrow of a dotted line indicates flow of the substrate and an arrow of asolid line indicates flow of the film-forming process.

As illustrated in FIG. 30C, the inner wall of the reaction chamber 400 ais cleaned with fluorine radicals or the like (S481), to remove residualimpurities in the reaction chamber 400 a. Then, the inner wall of thereaction chamber 400 a is coated with a film which is similar to asecond buffer layer (S482). Here, an amorphous silicon film is formed.Due to this coating step, metals which form the reaction chamber 400 acan be prevented from mixing into the gate insulating film asimpurities.

Then, the substrate set in the cassette in the load/unload chamber 422is transferred to the reaction chamber 400 a by the transfer mechanism426 in the common chamber 423 as indicated by the arrow a1. Then, thesecond buffer layer, which is an amorphous silicon film here, is formedover the substrate in the reaction chamber 400 a (S483).

Then, an impurity semiconductor film to which an impurity elementimparting one conductivity type is added (here, referred to as ann⁺a-Si-film) is formed over the substrate over which the second bufferlayer is formed (S484). Here, a coating step is not necessarilyperformed before forming the n⁺a-Si-film because the main components inthe amorphous silicon film and the n⁺a-Si-film are the same, andmoreover, amorphous silicon does not contain any substance which becomescontaminants of the n⁺a-Si-film film.

Then, the substrate over which the n⁺a-Si-film is formed is set in thecassette in the load/unload chamber 422 by the transfer mechanism 426 inthe common chamber 423 as indicated by the arrow a4. Through the aboveprocess, the second buffer layer and the n⁺a-Si-film can be formedsuccessively over the substrate over which the island-shapedsemiconductor film to which an impurity element serving as a donor isadded and first buffer layer are formed. Then, the inner wall of thereaction chamber 400 a is cleaned with fluorine radicals or the like(S485) to remove residual impurities in the reaction chamber 400 a.Then, the inner wall of the reaction chamber 400 a is coated with a filmwhich is similar to the second buffer layer (S486). Then, anothersubstrate which is set in the cassette in the load/unload chamber 422 istransferred to the reaction chamber 400 a, and the steps similar to theabove steps are performed on the substrate, starting with film formationof the second buffer layer (S483), to successively form the secondbuffer layer and the n⁺a-Si-film.

After the second buffer layers and the n⁺a-Si-films are formed over allthe substrates which are set in the cassette in the load/unload chamber422, the cassette is transferred from the load/unload chamber 422 to besubjected to a next process.

Through the above process, a plurality of films can be successivelyformed without being exposed to the atmosphere. In addition, the filmscan be formed without contaminants mixing into the films.

Embodiment Mode 14

In this embodiment mode, a liquid crystal display device including thethin film transistor described in any of the above embodiment modes isdescribed below as one mode of a display device. Here, a verticalalignment (VA) liquid crystal display device is described with referenceto FIG. 32, FIG. 33, and FIG. 34. The VA liquid crystal display deviceemploys one mode for controlling alignment of liquid crystal moleculesof a liquid crystal panel. The VA liquid crystal display device employsa mode in which liquid crystal molecules are vertical to a panel surfacewhen voltage is not applied. In particular, in this embodiment mode, apixel is divided into several regions (sub-pixels) so that molecules aretilted in a different orientation in each different region. This isreferred to as multi-domain or multi-domain design. In the followingdescription, a liquid crystal display device with multi-domain design isdescribed.

FIG. 32 and FIG. 33 illustrate a pixel structure in a VA liquid crystalpanel. FIG. 33 is a plan view of a substrate 600. FIG. 32 illustrates across-sectional structure along line Y-Z in FIG. 33. The followingdescription will be made with reference to both the drawings.

In this pixel structure, a plurality of pixel electrodes 624 and 626 areincluded in one pixel, and thin film transistors 628 and 629 areconnected to the pixel electrodes 624 and 626, respectively, through aplanarization film 622. The thin film transistors 628 and 629 are drivenby different gate signals. That is, a pixel of multi-domain design has astructure in which a signal applied to each of the pixel electrodes 624and 626 is independently controlled.

The pixel electrode 624 is connected to the thin film transistor 628through a wiring 618 in a contact hole 623. In a contact hole 627, thepixel electrode 626 is connected to the thin film transistor 629 througha wiring 619. A gate wiring 602 of the thin film transistor 628 and agate wiring 603 of the thin film transistor 629 are separated so thatdifferent gate signals can be given thereto. In contrast, a wiring 616serving as a data line is used in common by the thin film transistors628 and 629. The thin film transistors 628 and 629 can be manufacturedby the methods described in above embodiment modes.

The pixel electrodes 624 and 626 have different shapes and are separatedby a slit 625. The pixel electrode 626 surrounds the pixel electrode 624which has a V-shape. Timings of voltage application are differentbetween the pixel electrode 624 and the pixel electrode 626 by the thinfilm transistor 628 and the thin film transistor 629, so that alignmentof liquid crystal is controlled. When different gate signals aresupplied to the gate wiring 602 and the gate wiring 603, operationtimings of the thin film transistor 628 and the thin film transistor 629can be different. An alignment film 648 is formed over the pixelelectrodes 624 and 626.

A counter substrate 601 is provided with a light-blocking film 632, acoloring film 636, and a counter electrode 640. In addition, aplanarization film 637 is formed between the coloring film 636 and thecounter electrode 640 so that alignment disorder of liquid crystal isprevented. Further, an alignment film 646 is formed on the counterelectrode 640. FIG. 34 illustrates a structure of a counter substrateside. A slit 641 is formed in the counter electrode 640 which is used incommon between different pixels. The slit 641 and the slit 625 of thepixel electrodes 624 and 626 are alternately arranged so as not tooverlap; thus, an oblique electric field is effectively generated, andthe alignment of liquid crystal can be controlled. Accordingly, anorientation of alignment of the liquid crystals can be made differentdepending on location and the viewing angle is widened.

In this specification, a substrate, a coloring film, a light-blockingfilm, and a planarization film form a color filter. Note that either thelight-blocking film or the planarization film, or neither of them is notnecessarily formed over the substrate.

The coloring film has a function of preferentially transmitting light ofa predetermined wavelength range, among light of the wavelength range ofvisible light. In general, a coloring film which preferentiallytransmits light of a wavelength range of red light, a coloring filmwhich preferentially transmits light of a wavelength range of bluelight, and a coloring film which preferentially transmits light of awavelength range of green light are combined to be used for the colorfilter. However, the combination of the coloring films is not limited tothe above combination.

The pixel electrode 624, a liquid crystal layer 650, and the counterelectrode 640 overlap with each other to form a first liquid crystalelement. Further, a second liquid crystal element is formed byoverlapping of the pixel electrode 626, the liquid crystal layer 650,and the counter electrode 640. Furthermore, the multi-domain structureis employed in which the first liquid crystal element and the secondliquid crystal element are provided for one pixel.

Although a vertical alignment (VA) liquid crystal display device isdescribed here as a liquid crystal display device, the element substrateformed in accordance with any of the above embodiment modes can also beapplied to an FFS mode liquid crystal display device, an IPS mode liquidcrystal display device, a TN mode liquid crystal display device, and thelike.

The liquid crystal display device can be manufactured through the aboveprocess. Since inverted staggered thin film transistors with smalloff-current and high electric characteristics are used for the liquidcrystal display device of this embodiment mode, the liquid crystaldisplay device having high contrast and high visibility can bemanufactured.

Embodiment Mode 15

In this embodiment mode, a light-emitting device including the thin filmtransistor described in any of the above embodiment modes is describedbelow as one mode of a display device, and a structure of a pixelincluded in the light-emitting device is described. FIG. 35A illustratesone mode of a top view of a pixel. FIG. 35B illustrates one mode of across-sectional structure of the pixel along line A-B in FIG. 35A.

A display device including a light-emitting element utilizingelectroluminescence is described here as a light-emitting device.Light-emitting elements utilizing electroluminescence are classifiedaccording to whether a light-emitting material is an organic compound oran inorganic compound. In general, the former is referred to as anorganic EL element, and the latter is referred to as an inorganic ELelement. Here, the manufacturing process described in any of the aboveembodiment modes of the thin film transistor can be used.

In the case of an organic EL element, by applying voltage to alight-emitting element, electrons and holes are injected from a pair ofelectrodes into a layer including an organic compound with alight-emitting property to cause a current flow. Then, by recombinationof these carriers (electrons and holes), the organic compound with alight-emitting property forms an excited state, and light is emittedwhen the excited state returns to a ground state. Due to such amechanism, such a light-emitting element is called a current excitationtype light-emitting element.

Inorganic EL elements are classified, according to their elementstructures, into a dispersion type inorganic EL element and a thin-filmtype inorganic EL element. The dispersion type inorganic EL element hasa light-emitting layer in which particles of a light-emitting materialare dispersed in a binder. The mechanism of light emission of thedispersion type inorganic EL element is donor acceptor recombinationlight emission, which utilizes a donor level and an acceptor level. Thethin-film type inorganic EL element has a structure in which alight-emitting layer is interposed between dielectric layers and thelight-emitting layer interposed between the dielectric layers is furtherinterposed between electrodes and adopts local emission in which innershell electron transition of a metal ion is utilized. Note that thedescription is made here using an organic EL element as a light-emittingelement. In addition, the description is made using channel-etched thinfilm transistors as a switching thin film transistor for controllinginput of a signal to a first electrode and a driving thin filmtransistor which controls driving of a light-emitting element, but achannel protective thin film transistor can also be used as appropriate.

In FIGS. 35A and 35B, a first thin film transistor 74 a is a switchingthin film transistor for controlling input of a signal to a firstelectrode, and a second thin film transistor 74 b is a driving thin filmtransistor for controlling current or voltage supply to a light-emittingelement 94.

A gate electrode 51 a of the first thin film transistor 74 a isconnected to a scanning line, one of a source and a drain is connectedto wirings 71 a to 71 c which serve as signal lines, and the other ofthe source and the drain is connected to the gate electrode 51 b of thesecond thin film transistor 74 b. One of a source and a drain of thesecond thin film transistor 74 b is connected to power source lines 93 ato 93 c, and the other of the source and the drain is connected to afirst electrode 79 of a display device. A gate electrode, a gateinsulating film, and the power source line 93 a of the second thin filmtransistor 74 b form a capacitor 96, and the other of the source and thedrain of the first thin film transistor 74 a is connected to thecapacitor 96.

The capacitor 96 corresponds to a capacitor for holding voltage betweenthe gate and the source or between the gate and the drain (hereinafterreferred to as a gate voltage) of the second thin film transistor 74 bwhen the first thin film transistor 74 a is turned off, and is notnecessarily provided.

In this embodiment mode, the first thin film transistor 74 a and thesecond thin film transistor 74 b can be each formed using the thin filmtransistor described in any of the above embodiment modes. In addition,although both the first thin film transistor 74 a and the second thinfilm transistor 74 b are n-channel thin film transistors here, the firstthin film transistor 74 a and the second thin film transistor 74 b mayalso be formed using an n-channel thin film transistor and a p-channelthin film transistor, respectively. Further, both the first thin filmtransistor 74 a and the second thin film transistor 74 b may be formedusing p-channel thin film transistors.

A protective insulating film 76 is formed over the first thin filmtransistor 74 a and the second thin film transistor 74 b, and aplanarization film 78 is formed over the protective insulating film 76,and then the first electrode 79 is formed to be connected to a wiring 93f in a contact hole formed in the planarization film 78 and theprotective insulating film 76. The planarization film 78 is preferablyformed using an organic resin such as acrylic, polyimide, or polyamide,or a siloxane polymer. Since the first electrode 79 has a recessedportion in the contact hole, a partition wall 91 having an opening isprovided to cover the recessed portion of the first electrode 79. In theopening of the partition wall 91, an EL layer 92 is formed so as to bein contact with the first electrode 79, and a second electrode 93 isformed so as to cover the EL layer 92. A protective insulating film 95is formed so as to cover the second electrode 93 and the partition wall91.

Here, a light-emitting element 94 having a top emission structure isdescribed as a light-emitting element. Note that the light-emittingelement 94 with a top emission structure can emit light even in the casewhere it is over the first thin film transistor 74 a or the second thinfilm transistor 74 b; thus, a light emission area can be increased.However, if a film under the EL layer 92 is uneven, the thickness isnonuniform due to unevenness, and the second electrode 93 and the firstelectrode 79 are short-circuited, and a display defect is caused.Therefore, it is preferable to provide the planarization film 78.

The light-emitting element 94 corresponds to a region where the firstelectrode 79 and the second electrode 93 sandwich the EL layer 92. Inthe case of the pixel illustrated in FIG. 35B, light from thelight-emitting element 94 is emitted to the second electrode 93 side asindicated by an outline arrow.

As the first electrode 79 serving as a cathode, a known conductive filmcan be used as long as it has a low work function and reflects light.For example, Ca, Al, MgAg, AlLi, or the like is preferably used. The ELlayer 92 may be formed using a single layer or by stacking a pluralityof layers. When the EL layer 92 is formed using a plurality of layers,an electron-injection layer, an electron-transporting layer, alight-emitting layer, a hole-transporting layer, and a hole-injectinglayer are stacked in that order over the first electrode 79 which servesas a cathode. Note that it is not necessary to form all of these layers.The second electrode 93 serving as an anode is formed using alight-transmitting conductive material. For example, alight-transmitting conductive film of indium oxide containing tungstenoxide, indium zinc oxide containing tungsten oxide, indium oxidecontaining titanium oxide, indium tin oxide containing titanium oxide,ITO, indium zinc oxide, or indium tin oxide to which silicon oxide isadded may be used.

A light-emitting element having a top emission structure, in which lightis extracted from a side opposite to a substrate, is described here;however, a light-emitting element having a bottom emission structure, inwhich light is extracted from the substrate side, or a light-emittingelement having a dual emission structure, in which light is extractedfrom both the substrate side and the side opposite to the substrate, canalso be employed as appropriate.

Although an organic EL element is described here as a light-emittingelement, an inorganic EL element can also be provided as alight-emitting element.

Note that in this embodiment mode, an example in which a thin filmtransistor for controlling the driving of a light-emitting element (adriving thin film transistor) is electrically connected to thelight-emitting element is described; however, a thin film transistor forcontrolling current may be connected between the driving thin filmtransistor and the light-emitting element.

Through the above process, a light-emitting device can be manufactured.The light-emitting device of this embodiment mode uses invertedstaggered thin film transistors with small off-current and excellentelectric characteristics, and therefore can have high contrast and highvisibility.

Embodiment Mode 16

This embodiment mode describes a structure of a display panel, which isone mode of a display device of the present invention.

FIG. 36A illustrates a mode of a display panel in which a pixel portion6012 formed over a substrate 6011 is connected to a signal line drivercircuit 6013 that is formed separately. The pixel portion 6012 and ascanning line driver circuit 6014 are each formed using a thin filmtransistor in which a microcrystalline semiconductor film is used for achannel formation region. By forming the signal line driver circuitusing a transistor which has higher field effect mobility than the thinfilm transistor in which the microcrystalline semiconductor film is usedfor a channel formation region, an operation of the signal line drivercircuit which demands higher driving frequency than the scanning linedriver circuit can be stabilized. Note that the signal line drivercircuit 6013 may be formed using a transistor in which a single crystalsemiconductor is used for a channel formation region, a thin filmtransistor in which a polycrystalline semiconductor is used for achannel formation region, or a transistor in which SOI is used for achannel formation region. The pixel portion 6012, the signal line drivercircuit 6013, and the scanning line driver circuit 6014 are eachsupplied with potential of a power source, a variety of signals, and thelike through an FPC 6015. Further, a protection circuit may be providedbetween the signal line driver circuit 6013 and the FPC 6015 or betweenthe signal line driver circuit 6013 and the pixel portion 6012. Theprotection circuit includes one or more elements selected from a thinfilm transistor, a diode, a resistor, a capacitor, and the like.

Note that both the signal line driver circuit and the scanning linedriver circuit may be formed over the same substrate as the pixelportion.

Also, when a driver circuit is separately formed, a substrate providedwith the driver circuit is not always required to be attached to asubstrate provided with a pixel portion, and may be attached to, forexample, an FPC. FIG. 36B illustrates a mode of a display panel in whicha signal line driver circuit 6023 is formed separately and is connectedto a pixel portion 6022 and a scanning line driver circuit 6024 that areformed over a substrate 6021. The pixel portion 6022 and the scanningline driver circuit 6024 are each formed using a thin film transistor inwhich a microcrystalline semiconductor film is used for a channelformation region. The signal line driver circuit 6023 is connected tothe pixel portion 6022 through an FPC 6025. The pixel portion 6022, thesignal line driver circuit 6023, and the scanning line driver circuit6024 are each supplied with potential of a power source, a variety ofsignals, and the like through the FPC 6025. Further, a protectioncircuit may be provided between the signal line driver circuit 6023 andthe FPC 6025 or between the signal line driver circuit 6023 and thepixel portion 6022.

Furthermore, only a part of the signal line driver circuit or only apart of the scanning line driver circuit may be formed over the samesubstrate as the pixel portion with use of a thin film transistor inwhich a microcrystalline semiconductor film is used for a channelformation region, and the rest may be formed separately and electricallyconnected to the pixel portion. FIG. 36C illustrates a mode of a displaypanel in which an analog switch 6033 a included in the signal drivercircuit is formed over a substrate 6031, over which a pixel portion 6032and a scanning line driver circuit 6034 are formed, and a shift register6033 b included in the signal line driver circuit is formed separatelyover a different substrate and then attached to the substrate 6031. Thepixel portion 6032 and the scanning line driver circuit 6034 are eachformed using a thin film transistor in which a microcrystallinesemiconductor film is used for a channel formation region. The shiftregister 6033 b included in the signal line driver circuit is connectedto the pixel portion 6032 through an FPC 6035. The pixel portion 6032,the signal line driver circuit, and the scanning line driver circuit6034 are each supplied with a potential of a power source, a variety ofsignals, and the like through the FPC 6035. Further, a protectioncircuit may be provided between the signal line driver circuit 6033 andthe FPC 6035 or between the signal line driver circuit 6033 and thepixel portion 6032.

As illustrated in FIGS. 36A to 36C, in the display device of thisembodiment mode, an entire driver circuit or a part thereof can beformed over the same substrate as a pixel portion, using a thin filmtransistor in which a microcrystalline semiconductor films is used for achannel formation region.

Note that there is no particular limitation on a connection method ofthe substrate which is formed separately, and a known method such as aCOG method, a wire bonding method, or a TAB method can be used. Further,a connection position is not limited to the position illustrated inFIGS. 36A to 36C, as long as electrical connection is possible.Alternatively, a controller, a CPU, a memory, and/or the like may beformed separately and connected.

Note that the signal line driver circuit used in the present inventionincludes a shift register and an analog switch. In addition to the shiftregister and the analog switch, another circuit such as a buffer, alevel shifter, or a source follower may be included. Moreover, the shiftregister and the analog switch are not necessarily provided. Forexample, a different circuit such as a decoder circuit by which a signalline can be selected may be used instead of the shift register, or alatch or the like may be used instead of the analog switch.

Embodiment Mode 17

The display device and the like obtained by the present invention can beused for an active matrix display panel. That is, the present inventioncan be applied to all electronic devices in which the display panel isincorporated into a display portion.

Examples of such electronic devices include cameras such as videocameras and digital cameras, head-mounted displays (goggle-typedisplays), car navigation systems, projectors, car stereo sets, personalcomputers, and portable information terminals (e.g., mobile computers,cellular phones, and e-book readers). Examples of these devices areillustrated in FIGS. 37A to 37D.

FIG. 37A illustrates a television device. A television device can becompleted by incorporation of a display panel into a chassis asillustrated in FIG. 37A. A main screen 2003 is formed using the displaypanel, and a speaker portion 2009, operation switches, and the like areprovided as other additional accessories. In such a manner, a televisiondevice can be completed.

As illustrated in FIG. 37A, a display panel 2002 using display elementsis incorporated into a chassis 2001, and in addition to reception ofgeneral television broadcast by a receiver 2005, communication ofinformation in one direction (from a transmitter to a receiver) or intwo directions (between a transmitter and a receiver or betweenreceivers) can be performed by connection to a wired or wirelesscommunication network via a modem 2004. The television device can beoperated with switches that are incorporated into the chassis or by aremote control device 2006 provided separately. The remote controldevice 2006 may be provided with a display portion 2007 that displaysinformation to be output.

Further, the television device may include a sub-screen 2008 formedusing a second display panel for displaying channels, sound volume, orthe like, in addition to the main screen 2003. In this structure, themain screen 2003 may be formed with a liquid crystal display panel, andthe sub-screen 2008 may be formed with a light-emitting display panel.In addition, the main screen 2003 and the sub-screen 2008 may be eachformed with a light-emitting display panel and the sub-screen may blink.

FIG. 38 illustrates a block diagram illustrating the main structure of atelevision device. A display panel 900 is provided with a pixel portion921. A signal line driver circuit 922 and a scanning line driver circuit923 may be mounted on the display panel 900 by a COG method.

As structures of other external circuits; a video signal amplifiercircuit 925 amplifying a video signal among signals received by a tuner924; a video signal processing circuit 926 converting signals outputfrom the video signal amplifier circuit 925 into chrominance signalscorresponding to red, green, and blue; a control circuit 927 forconverting the video signal into a signal which meets inputspecifications of a driver IC; and the like are provided on an inputside of the video signal. The control circuit 927 outputs signals to thescanning line side and the signal line side. When digital driving isperformed, a structure may be adopted in which a signal dividing circuit928 is provided on the signal line side and an input digital signal isdivided into m signals to be supplied.

An audio signal among signals received by the tuner 924 is transmittedto an audio signal amplifier circuit 929, and output from the audiosignal amplifier circuit 929 is supplied to a speaker 933 through anaudio signal processing circuit 930. A control circuit 931 receivescontrol information on receiving station (receiving frequency) and soundvolume from an input portion 932 and transmits a signal to the tuner 924and the audio signal processing circuit 930.

Needless to say, the present invention is not limited to a televisiondevice and can be applied to a variety of uses, such as a monitor of apersonal computer, a large display medium such as an information displayboard at the train station, the airport, or the like, or anadvertisement display board on the street.

The display device described in any of the above embodiment modes isapplied to the main screen 2003 and the sub-screen 2008, so that massproductivity of the television device with improved image quality suchas contrast can be improved.

FIG. 37B illustrates one mode of a cellular phone 2301. The cellularphone 2301 includes a display portion 2302, an operation portion 2303,and the like. The display device described in any of the aboveembodiment modes is applied to the display portion 2302, so that massproductivity of the cellular phone with improved image quality such ascontrast can be improved.

A portable computer illustrated in FIG. 37C includes a main body 2401, adisplay portion 2402, and the like. The display device described in anyof the above embodiment modes is applied to the display portion 2402, sothat mass productivity of the computer with improved image quality suchas contrast can be improved.

FIG. 37D illustrates a desk lamp including a lighting portion 2501, ashade 2502, an adjustable arm 2503, a support 2504, a base 2505, and apower source switch 2506. The desk lamp is manufactured with use of thelight-emitting device of the present invention for the lighting portion2501. Note that the lighting equipment includes a ceiling light, a walllight, and the like. When the display device described in any of theabove embodiment modes is employed, mass productivity can be improvedand an inexpensive desk lighting appliance can be provided.

FIGS. 39A to 39C illustrate an example of a structure of a smartphone towhich the present invention is applied. FIG. 39A is a front view, FIG.39B is a rear view, and FIG. 39C is a development view. The smartphonehas two chassis 1001 and 1002. The smartphone is a so-called smartphonewhich has both functions of a cellular phone and a portable informationterminal, and incorporates a computer and can process a variety of dataprocessing in addition to voice calls.

The smartphone has the two chassis 1001 and 1002. The chassis 1001includes a display portion 1101, a speaker 1102, a microphone 1103,operation keys 1104, a pointing device 1105, a front camera lens 1106,an external connection terminal jack 1107, an earphone terminal 1008,and the like, while the chassis 1002 includes a keyboard 1201, anexternal memory slot 1202, a rear camera 1203, a light 1204, and thelike. In addition, an antenna is incorporated in the chassis 1001.

Further, in addition to the above structure, the smartphone mayincorporate a non-contact IC chip, a small size memory device, or thelike.

The chassis 1001 and the chassis 1002 which are put together to belapped with each other (see FIG. 39A) are slid to expose the chassis1002 as illustrated in FIG. 39C. In the display portion 1101, thedisplay device described in any of the above embodiment modes can beincorporated, and a display orientation can be changed as appropriateaccording to a usage pattern. Because the front camera lens 1106 isprovided in the same plane as the display portion 1101, the smartphonecan be used as a videophone. Further, a still image and a moving imagecan be taken with the rear camera 1203 and the light 1204 using thedisplay portion 1101 as a viewfinder.

The speaker 1102 and the microphone 1103 can be used for video calls,recording and playing sound, and the like without being limited to voicecalls. With the operation keys 1104, making and receiving calls,inputting simple information such as e-mails or the like, scrolling thescreen, moving the cursor, and the like are possible.

If much information is needed to be treated, such as the case in whichthe smartphone is used for documentation or used as a portableinformation terminal, the use of the keyboard 1201 is convenient. Whenthe chassis 1001 and the chassis 1002 which are put together to belapped with each other (FIG. 39A) are slid as illustrated in FIG. 39C sothat the smartphone is used as a portable information terminal, smoothoperation can be conducted by using the keyboard 1201 and the pointingdevice 1105. To the external connection terminal jack 1107, an ACadaptor and various types of cables such as a USB cable can beconnected, and charging and data communication with a personal computeror the like are possible. Moreover, by inserting a storage medium intothe external memory slot 1202, a large amount of data can be stored andmoved.

In the rear surface of the chassis 1002 (FIG. 39B), the rear camera 1203and the light 1204 are provided, and a still image and a moving imagecan be taken using the display portion 1101 as a viewfinder.

Further, the smartphone may have an infrared communication function, aUSB port, a function of receiving one segment television broadcast, anon-contact IC chip, an earphone jack, or the like, in addition to theabove-described functions and structures.

By employing the display device described in above embodiment modes,mass productivity of the smartphone can be increased.

This application is based on Japanese Patent Application serial no.2007-312933 filed with Japan Patent Office on Dec. 3, 2007, and onJapanese Patent Application serial no. 2007-339412 filed with JapanPatent Office on Dec. 28, 2007, the entire contents of which are herebyincorporated by reference.

1. A semiconductor device comprising a thin film transistor comprising:a gate electrode having an inner region and an end portion; a gateinsulating film formed over the gate electrode; a semiconductor filmformed over the gate insulating film, wherein the semiconductor filmovelaps the inner region, and does not overlap the end portion; a filmformed so as to cover a side surface of the semiconductor film; a sourcewiring formed over the film; and a drain wiring formed over the film,wherein the side surface faces to any one of the source wiring and thedrain wiring, with the film interposed therebetween, and wherein thefilm is not a conductive film.
 2. The semiconductor device according toclaim 1, wherein the semiconductor film comprises an impurity elementserving as a donor.
 3. The semiconductor device according to claim 1,wherein the semiconductor film is one selected from the group consistingof an amorphous silicon film, an amorphous silicon germanium film, anamorphous germanium film, a microcrystalline silicon film, amicrocrystalline silicon germanium film, a microcrystalline germaniumfilm, a polycrystalline silicon film, a polycrystalline silicongermanium film, and a polycrystalline germanium film.
 4. Thesemiconductor device according to claim 1, wherein the semiconductorfilm comprises: crystal grains to which the impurity element is added;and a first semiconductor film formed to cover the crystal grains, towhich germanium is added.
 5. The semiconductor device according to claim1, wherein the impurity element is any one of phosphorus, arsenic, orantimony.
 6. The semiconductor device according to claim 1, wherein thesemiconductor device is a display device.
 7. A semiconductor devicecomprising a thin film transistor comprising: a gate electrode having aninner region and an end portion; a gate insulating film formed over thegate electrode; a semiconductor film formed over the gate insulatingfilm, wherein the semiconductor film ovelaps the inner region, and doesnot overlap the end portion; a film formed so as to cover an uppersurface and a side surface of the semiconductor film; a source wiringformed over the film; and a drain wiring formed over the film, whereinthe side surface faces to any one of the source wiring and the drainwiring, with the film interposed therebetween, and wherein the film isan amorphous semiconductor film.
 8. The semiconductor device accordingto claim 7, wherein the semiconductor film comprises an impurity elementserving as a donor.
 9. The semiconductor device according to claim 7,wherein the semiconductor film is one selected from the group consistingof an amorphous silicon film, an amorphous silicon germanium film, anamorphous germanium film, a microcrystalline silicon film, amicrocrystalline silicon germanium film, a microcrystalline germaniumfilm, a polycrystalline silicon film, a polycrystalline silicongermanium film, and a polycrystalline germanium film.
 10. Thesemiconductor device according to claim 7, wherein the semiconductorfilm comprises: crystal grains to which the impurity element is added;and a first semiconductor film formed to cover the crystal grains, towhich germanium is added.
 11. The semiconductor device according toclaim 7, wherein the impurity element is any one of phosphorus, arsenic,or antimony.
 12. The semiconductor device according to claim 7, whereinthe semiconductor device is a display device.
 13. A semiconductor devicecomprising a thin film transistor comprising: a gate electrode having aninner region and an end portion; a gate insulating film formed over thegate electrode; a semiconductor film formed over the gate insulatingfilm, wherein the semiconductor film ovelaps the inner region, and doesnot overlap the end portion; a buffer layer formed over thesemiconductor film; a source region formed over the buffer layer; adrain region formed over the buffer layer; a film formed so as to covera side surface of the semiconductor film, of the buffer layer, of thesource region and of the drain region; a source wiring formed over thefilm, connected to the source region; and a drain wiring formed over thefilm, connected to the drain region, wherein the buffer layer is anamorphous semiconductor film, wherein the side surface faces to any oneof the source wiring and the drain wiring, with the film interposedtherebetween, and wherein the film is an insulating film.
 14. Thesemiconductor device according to claim 13, wherein the semiconductorfilm comprises an impurity element serving as a donor.
 15. Thesemiconductor device according to claim 13, wherein the semiconductorfilm is one selected from the group consisting of an amorphous siliconfilm, an amorphous silicon germanium film, an amorphous germanium film,a microcrystalline silicon film, a microcrystalline silicon germaniumfilm, a microcrystalline germanium film, a polycrystalline silicon film,a polycrystalline silicon germanium film, and a polycrystallinegermanium film.
 16. The semiconductor device according to claim 13,wherein the semiconductor film comprises: crystal grains to which theimpurity element is added; and a first semiconductor film formed tocover the crystal grains, to which germanium is added.
 17. Thesemiconductor device according to claim 13, wherein the impurity elementis any one of phosphorus, arsenic, or antimony.
 18. The semiconductordevice according to claim 13, wherein the semiconductor device is adisplay device.
 19. A semiconductor device comprising a thin filmtransistor comprising: a gate electrode having an inner region and anend portion; a gate insulating film formed over the gate electrode; asemiconductor film formed over the gate insulating film, wherein thesemiconductor film ovelaps the inner region, and does not overlap theend portion; a buffer layer formed over the semiconductor film; a filmformed so as to cover a side surface of the semiconductor film and ofthe buffer layer; a source region formed over the film, connected to thebuffer layer; a drain region formed over the film, connected to thebuffer layer; a source wiring formed over the source region; and a drainwiring formed over the drain region, wherein the buffer layer is anamorphous semiconductor film, wherein the side surface faces to any oneof the source wiring and the drain wiring, with the film interposedtherebetween, and wherein the film is an insulating film.
 20. Thesemiconductor device according to claim 19, wherein the semiconductorfilm comprises an impurity element serving as a donor.
 21. Thesemiconductor device according to claim 19, wherein the semiconductorfilm is one selected from the group consisting of an amorphous siliconfilm, an amorphous silicon germanium film, an amorphous germanium film,a microcrystalline silicon film, a microcrystalline silicon germaniumfilm, a microcrystalline germanium film, a polycrystalline silicon film,a polycrystalline silicon germanium film, and a polycrystallinegermanium film.
 22. The semiconductor device according to claim 19,wherein the semiconductor film comprises: crystal grains to which theimpurity element is added; and a first semiconductor film formed tocover the crystal grains, to which germanium is added.
 23. Thesemiconductor device according to claim 19, wherein the impurity elementis any one of phosphorus, arsenic, or antimony.
 24. The semiconductordevice according to claim 19, wherein the semiconductor device is adisplay device.